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LC4256V-75T176I

Description
CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD
CategoryProgrammable logic devices    Programmable logic   
File Size7MB,100 Pages
ManufacturerLattice
Websitehttp://www.latticesemi.com
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LC4256V-75T176I Overview

CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD

LC4256V-75T176I Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerLattice
Parts packaging codeQFP
package instructionTQFP-176
Contacts176
Reach Compliance Codenot_compliant
ECCN codeEAR99
Other featuresYES
maximum clock frequency111 MHz
In-system programmableYES
JESD-30 codeS-GQFP-G176
JESD-609 codee0
JTAG BSTYES
length24 mm
Humidity sensitivity level3
Dedicated input times4
Number of I/O lines128
Number of macro cells256
Number of terminals176
organize4 DEDICATED INPUTS, 128 I/O
Output functionMACROCELL
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeLFQFP
Encapsulate equivalent codeQFP176,1.0SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)256
power supply3.3 V
Programmable logic typeEE PLD
propagation delay7.5 ns
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width24 mm
Base Number Matches1
ispMACH 4000V/B/C/Z Family
®
3.3 V/2.5 V/1.8 V In-System Programmable
SuperFAST
TM
High Density PLDs
April 2016
Data Sheet DS1020
Features
High Performance
f
MAX
= 400 MHz maximum operating frequency
t
PD
= 2.5 ns propagation delay
Up to four global clock pins with programmable
clock polarity control
• Up to 80 PTs per output
Broad Device Offering
• Multiple temperature range support
– Commercial: 0 to 90 °C junction (T
j
)
– Industrial: –40 to 105 °C junction (T
j
)
– Extended: –40 to 130 °C junction (T
j
)
• For AEC-Q100 compliant devices, refer to
LA-ispMACH 4000V/Z Automotive Data Sheet
Ease of Design
• Enhanced macrocells with individual clock,
reset, preset and clock enable controls
• Up to four global OE controls
• Individual local OE control per I/O pin
• Excellent First-Time-Fit
TM
and refit
• Fast path, SpeedLocking
TM
Path, and wide-PT
path
• Wide input gating (36 input logic blocks) for fast
counters, state machines and address decoders
Easy System Integration
• Superior solution for power sensitive consumer
applications
• Operation with 3.3 V, 2.5 V or 1.8 V LVCMOS I/O
• Operation with 3.3 V (4000V), 2.5 V (4000B) or
1.8 V (4000C/Z) supplies
• 5 V tolerant I/O for LVCMOS 3.3, LVTTL, and
PCI interfaces
• Hot-socketing
• Open-drain capability
• Input pull-up, pull-down or bus-keeper
• Programmable output slew rate
• 3.3 V PCI compatible
• IEEE 1149.1 boundary scan testable
• 3.3 V/2.5 V/1.8 V In-System Programmable
(ISP™) using IEEE 1532 compliant interface
• I/O pins with fast setup path
• Lead-free package options
Zero Power (ispMACH 4000Z) and Low
Power (ispMACH 4000V/B/C)
Typical static current 10 µA (4032Z)
Typical static current 1.3 mA (4000C)
1.8 V core low dynamic power
ispMACH 4000Z operational down to 1.6 V V
CC
Table 1. ispMACH 4000V/B/C Family Selection Guide
ispMACH
4032V/B/C
Macrocells
I/O + Dedicated Inputs
t
PD
(ns)
t
S
(ns)
t
CO
(ns)
f
MAX
(MHz)
Supply Voltages (V)
Pins/Package
32
30+2/32+4
2.5
1.8
2.2
400
3.3/2.5/1.8V
44
48 TQFP
TQFP
4
4
ispMACH
4064V/B/C
64
30+2/32+4/
64+10
2.5
1.8
2.2
400
3.3/2.5/1.8V
44
48 TQFP
100 TQFP
TQFP
4
4
ispMACH
4128V/B/C
128
64+10/92+4/
96+4
2.7
1.8
2.7
333
3.3/2.5/1.8V
ispMACH
4256V/B/C
256
64+10/96+14/
128+4/160+4
3.0
2.0
2.7
322
3.3/2.5/1.8V
ispMACH
4384V/B/C
384
128+4/192+4
3.5
2.0
2.7
322
3.3/2.5/1.8V
ispMACH
4512V/B/C
512
128+4/208+4
3.5
2.0
2.7
322
3.3/2.5/1.8V
100 TQFP
128 TQFP
144 TQFP
1
100 TQFP
144 TQFP
1
176 TQFP
256 ftBGA
2
/
fpBGA
2, 3
176 TQFP
256 ftBGA/
fpBGA
3
176 TQFP
256 ftBGA/
fpBGA
3
1.
2.
3.
4.
3.3 V (4000V) only.
128-I/O and 160-I/O configurations.
Use 256 ftBGA package for all new designs. Refer to PCN#14A-07 for 256 fpBGA package discontinuance.
1.0 mm thickness.
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1
DS1020_23.5

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