AH11
High Dynamic Range Dual Amplifier
Product Features
•
150 – 3000 MHz
•
+44 dBm OIP3
(balanced configuration)
Product Description
The AH11 is a high linearity amplifier for use in digital
communication systems. It combines low noise figure and
high intercept point into a low-cost SMT solution. This
device extends the linear efficiency advantages of WJ’s AH1
to higher power levels by combining two internally matched
die. This dual-amplifier configuration allows for the optimal
design of balanced or push-pull operation. The amplifier
can also be used for single-ended operation in each branch
of a diversity receive system.
A mature and reliable GaAs MESFET technology is
employed to maximize linearity while achieving low noise
figure. The package is a thermally enhanced lead-
free/green/RoHS-compliant SOIC-8 package thus allowing
the device to achieve an MTTF greater than 100 years at a
case temperature of 85
°C.
All devices are 100% RF and
DC tested.
Functional Diagram
1
2
3
4
8
7
6
5
•
+48 dBm OIP3
(dual push-pull configuration)
•
Single-ended performance:
13.5 dB Gain
2.7 dB Noise Figure
+21 dBm P1dB
•
Single +5 Volt Supply
•
Lead-free/green/RoHS-
compliant SOIC-8 package
Function
Input (Amp 1)
Ground
Input (Amp 2)
Output (Amp 1)
Output (Amp 2)
Applications
•
Mobile Infrastructure
•
Defense / Homeland Security
•
Fixed Wireless
Pin No.
1
2, 3, 6, 7,
Bottom Slug
4
5
8
Specifications
(1)
(Single-ended Performance)
Parameter
Test Frequency
Gain
Input Return Loss
(2)
Output Return Loss
Output IP3
(3)
Output P1dB
Noise Figure
Operating Current Range
Supply Voltage
Typical Performance
(Balanced Configuration)
Parameter
Frequency
S21
S11
S22
Output IP3
Noise Figure
Supply Bias
Units
MHz
dB
dB
dB
dBm
dBm
dB
mA
V
Min
12.4
Typ
800
13.5
8
15
+41
+21
2.7
150
+5
Max
Units
MHz
dB
dB
dB
dBm
dB
900
12.2
-10
-18
+46
4.1
Typical
1900
11.2
-14
-10
+44
4.2
+5 V @ 300 mA
2100
10.6
-10
-10
+45
5.6
+37
120
180
Test conditions: T = 25 ºC, in a tuned application circuit (shown on page 2)
1. Test conditions unless otherwise noted: T = 25 ºC, Supply Voltage = +5 V, Frequency = 800 MHz,
50
Ω
System, tested on each single-ended amplifier (there are two amplifiers in an AH11 package)
2. S21 and S11 can be improved in the band of interest with some slight input tuning.
3. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Slight OIP3
degradation of about 2 dB is expected to occur at lower temperatures (from 25 ºC to –40 ºC).
Typical Performance
(Dual P-P Configuration)
Parameter
Frequency
S21
S11
S22
Output IP3
Noise Figure
Supply bias
Units
MHz
dB
dB
dB
dBm
dB
Typical
900
1900
13.4
11.9
-19
-19
-12
-10
+48
+48
3.4
3.7
+5 V @ 600 mA
Test conditions: T = 25 ºC, in a tuned application circuit (shown on pages 3 and 4)
Absolute Maximum Rating
Parameter
Storage Temperature
Supply Voltage
RF Input Power (continuous)
Thermal Resistance, Rth
Junction Temperature
Ordering Information
Part No.
AH11-G
AH11BAL-PCB
AH11PP900-PCB
AH11PP1900-PCB
Rating
-55 to +125
°C
+6 V
4 dB above Input P1dB
29°C/W
+160°C
Description
High Dynamic Range CATV Amplifier
(lead-free/green/RoHS-compliant SOIC-8 Package)
0.6-2.1GHz Eval Board, Balanced Configuration
0.9GHz Eval Board, Dual Push-Pull Configuration
1.9GHz Eval Board, Dual Push-Pull Configuration
Operation of this device above any of these parameters may cause permanent damage.
Standard tape / reel size = 500 pieces on a 7” reel
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 1 of 6 May 2008
AH11
High Dynamic Range Dual Amplifier
Balanced Circuit: 600 – 2100 MHz
Performance Charts
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 2 of 6 May 2008
AH11
High Dynamic Range Dual Amplifier
Dual Push-Pull Circuit: 900 MHz
Performance Charts
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 3 of 6 May 2008
AH11
High Dynamic Range Dual Amplifier
Dual Push-Pull Circuit: 1900 MHz
Performance Charts
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 4 of 6 May 2008
AH11
High Dynamic Range Dual Amplifier
AH11-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both
lead-free (maximum 260
°C
reflow temperature) and lead (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH11-G” designator with an alphanumeric
lot code on the top surface of the package.
The obsolete tin-lead package is marked with
an “AH11” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value
Test:
Standard:
Class 1B
Passes from 500 to 1000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020A
Functional Pin Layout
Land Pattern
Pin
1
2
3
4
5
6
7
8
Function
RF input (Amp1 input)
Ground
Ground
RF input (Amp2 input)
RF output (Amp2 output)
Ground
Ground
RF output (Amp1 output)
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
Mounting Config. Notes
1.
2.
3.
4.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80/.0135”)
diameter drill and have a final plated through diameter
of .25mm (.010”)
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
All dimensions are in mm. Angles are in degrees.
5.
6.
7.
8.
9.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com, www.TriQuint.com
Page 5 of 6 May 2008
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