MC14503BFEL datasheet, PDF - EEWORLD Datasheet

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MC14503BFEL: DescriptionBuffers & Line Drivers 3-18V Hex 3-State; Categorylogic logic; File Size128KB，7 Pages; ManufacturerON Semiconductor; Websitehttp://www.onsemi.cn; Environmental Compliance

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MC14503BFEL Overview

Buffers & Line Drivers 3-18V Hex 3-State

MC14503BFEL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ON Semiconductor
Parts packaging code	SOIC
package instruction	EIAJ, SO-16
Contacts	16
Reach Compliance Code	unknown
Control type	ENABLE LOW
series	4000/14000/40000
JESD-30 code	R-PDSO-G16
JESD-609 code	e4
length	10.2 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
Humidity sensitivity level	3
Number of digits	6
Number of functions	1
Number of ports	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	5/15 V
Prop。Delay @ Nom-Sup	150 ns
propagation delay (tpd)	150 ns
Certification status	Not Qualified
Maximum seat height	2.05 mm
Maximum supply voltage (Vsup)	18 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	5.275 mm

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MC14503B

Hex Non-Inverting 3-State

Buffer

The MC14503B is a hex non−inverting buffer with 3−state outputs,

and a high current source and sink capability. The 3−state outputs

make it useful in common bussing applications. Two disable controls

are provided. A high level on the Disable A input causes the outputs of

buffers 1 through 4 to go into a high impedance state and a high level

on the Disable B input causes the outputs of buffers 5 and 6 to go into a

high impedance state.

Features

http://onsemi.com

MARKING

DIAGRAMS

PDIP−16

P SUFFIX

CASE 648

SOIC−16

D SUFFIX

CASE 751B

WL, L

YY, Y

WW, W

14503BG

AWLYWW

MC14503BCP

AWLYYWWG

•

3−State Outputs

•

TTL Compatible — Will Drive One TTL Load Over Full

•

Temperature Range

Supply Voltage Range = 3.0 Vdc to 18 Vdc

Two Disable Controls for Added Versatility

Pin for Pin Replacement for MM80C97 and 340097

These Devices are Pb−Free and are RoHS Compliant

NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

MAXIMUM RATINGS

(Voltages Referenced to V

) (Note 1)

Parameter

DC Supply Voltage Range

Input or Output Voltage Range

(DC or Transient)

Input Current (DC or Transient) per Pin

Output Current (DC or Transient) per Pin

Power Dissipation, per Package (Note 2)

Ambient Temperature Range

Storage Temperature Range

Lead Temperature (8−Second Soldering)

Symbol

, V

out

Value

−0.5

to +18.0

−0.5

to V

+ 0.5

500

−55

to +125

−65

to +150

260

Unit

°C

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Maximum Ratings are those values beyond which damage to the device may

occur.

2. Temperature Derating:

Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C

This device contains protection circuitry to guard against damage due to high

static voltages or electric fields. However, precautions must be taken to avoid

applications of any voltage higher than maximum rated voltages to this

high−impedance circuit. For proper operation, V

and V

out

should be constrained

to the range V

or V

out

)

Unused inputs must always be tied to an appropriate logic voltage level

(e.g., either V

or V

). Unused outputs must be left open.

Semiconductor Components Industries, LLC, 2013

May, 2013

−

Rev. 9

Publication Order Number:

MC14503B/D

MC14503BFEL Related Products

	MC14503BFEL	MC14503BCPG	MC14503BD	MC14503BCP
Description	Buffers & Line Drivers 3-18V Hex 3-State	Buffers & Line Drivers 3-18V Hex 3-State Non-Inverting	Buffers & Line Drivers 3-18V Hex 3-State	Buffers & Line Drivers 3-18V Hex 3-State
Is it Rohs certified?	conform to	conform to	incompatible	incompatible
Parts packaging code	SOIC	DIP	SOIC	DIP
package instruction	EIAJ, SO-16	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3
Contacts	16	16	16	16
Reach Compliance Code	unknown	unknown	not_compliant	not_compliant
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
series	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 code	R-PDSO-G16	R-PDIP-T16	R-PDSO-G16	R-PDIP-T16
JESD-609 code	e4	e3	e0	e0
length	10.2 mm	19.175 mm	9.9 mm	19.175 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
Number of digits	6	6	6	6
Number of functions	1	1	1	1
Number of ports	2	2	2	2
Number of terminals	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	SOP	DIP
Encapsulate equivalent code	SOP16,.3	DIP16,.3	SOP16,.25	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE
method of packing	TAPE AND REEL	RAIL	RAIL	RAIL
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	240	NOT SPECIFIED
power supply	5/15 V	5/15 V	5/15 V	5/15 V
Prop。Delay @ Nom-Sup	150 ns	150 ns	150 ns	150 ns
propagation delay (tpd)	150 ns	150 ns	150 ns	150 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.05 mm	4.44 mm	1.75 mm	4.44 mm
Maximum supply voltage (Vsup)	18 V	18 V	18 V	18 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Matte Tin (Sn) - annealed	Tin/Lead (Sn/Pb)	Tin/Lead (Sn80Pb20)
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	NOT SPECIFIED	30	NOT SPECIFIED
width	5.275 mm	7.62 mm	3.9 mm	7.62 mm

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