Microprocessors - MPU POWER QUICC II HIP6W
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| Parts packaging code | BGA |
| package instruction | BGA, |
| Contacts | 256 |
| Reach Compliance Code | not_compliant |
| ECCN code | 5A991 |
| Other features | ALSO REQUIRES 3.3V SUPPLY |
| Address bus width | 32 |
| bit size | 32 |
| boundary scan | YES |
| maximum clock frequency | 66 MHz |
| External data bus width | 32 |
| Format | FIXED POINT |
| Integrated cache | YES |
| JESD-30 code | S-PBGA-B256 |
| JESD-609 code | e0 |
| length | 23 mm |
| low power mode | YES |
| Humidity sensitivity level | 3 |
| Number of terminals | 256 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 220 |
| Certification status | Not Qualified |
| Maximum seat height | 2.54 mm |
| speed | 100 MHz |
| Maximum supply voltage | 1.9 V |
| Minimum supply voltage | 1.7 V |
| Nominal supply voltage | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| width | 23 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
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