Si9926CDY-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
1
N-Channel
MOSFET
S
2
N-Channel
MOSFET
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
I
AS
E
AS
P
D
T
J
, T
stg
Limit
20
± 12
8
a
8
a
8
a, b, c
6.7
b, c
30
2.6
1.7
b, c
5
1.25
3.1
2
b, c
2
1.3
b, c
- 55 to 150
mJ
A
Unit
V
T
C
= 25 °C
T
C
= 70 °C
Maximum Power Dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Foot (Drain)
a, c, d
t
≤
10 s
Steady State
Symbol
R
thJA
R
thJF
Typical
50
32
Maximum
62.5
40
Unit
°C/W
Notes:
a. Package limited, T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 110 °C/W.
Document Number: 68606
S09-0704-Rev. B, 27-Apr-09
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1
New Product
Si9926CDY
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 6.7 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 6.7 A, V
GS
= 0 V
0.8
20
10
10
10
T
C
= 25 °C
2.6
30
1.2
40
20
A
V
ns
nC
ns
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 10 V, R
L
= 1.5
Ω
I
D
≅
6.7 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 10 V, R
L
= 1.5
Ω
I
D
≅
6.7 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
V
DS
= 10 V, V
GS
= 10 V, I
D
= 8.3 A
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 8.3 A
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 12 V
V
DS
= 20 V, V
GS
= 0 V
V
DS
= 20 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 4.5 V
V
GS
=
4.5 V, I
D
= 8.3 A
V
GS
=
2.5 V, I
D
= 4.5 A
V
DS
= 10 V, I
D
= 8.3 A
30
0.015
0.017
45
1200
220
100
22
10
2.5
1.7
2.4
15
10
35
12
10
12
25
10
25
15
55
20
15
20
40
15
ns
Ω
33
15
nC
pF
0.018
0.022
0.6
20
25
- 4.0
1.5
± 100
1
10
µA
A
Ω
S
mV/°C
V
nA
V
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 68606
S09-0704-Rev. B, 27-Apr-09
New Product
Si9926CDY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
30
V
GS
= 5
V
thru 2.5
V
24
I
D
- Drain Current (A)
I
D
- Drain Current (A)
8
10
T
C
= - 55 °C
18
V
GS
= 2
V
12
6
T
C
= 125 °C
4
6
V
GS
= 1
V
0
0.0
0.5
1.0
1.5
2.0
V
GS
= 1.5
V
2.5
3.0
2
T
C
= 25 °C
0
0.0
0.5
1.0
1.5
2.0
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.022
1500
C
iss
1200
C - Capacitance (pF)
V
GS
= 2.5
V
Transfer Characteristics
0.020
R
DS(on)
- On-Resistance (Ω)
0.018
900
0.016
600
C
oss
300
C
rss
0.014
V
GS
= 4.5
V
0.012
0.010
0
6
12
18
24
30
0
0
5
10
15
20
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current
10
I
D
=
8.3
A
V
GS
- Gate-to-Source
Voltage
(V)
8
R
DS(on)
- On-Resistance
V
DS
= 10
V
6
V
DS
= 16
V
4
1.4
1.6
I
D
=
8.3
A
Capacitance
V
GS
= 4.5
V,
2.5
V
(Normalized)
1.2
1.0
2
0.8
0
0
5
10
15
20
25
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 68606
S09-0704-Rev. B, 27-Apr-09
www.vishay.com
3
New Product
Si9926CDY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.040
I
D
=
8.3
A
T
J
= 150 °C
10
R
DS(on)
- On-Resistance (Ω)
0.030
I
S
- Source Current (A)
T
J
= 25 °C
T
J
= 125 °C
0.020
T
J
= 25 °C
0.010
1
0.0
0.000
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
10
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
1.4
30
On-Resistance vs. Gate-to-Source Voltage
1.2
I
D
= 250
µA
25
20
V
GS(th)
(V)
1.0
Power (W)
15
0.8
10
0.6
5
0.4
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
100
µs
Single Pulse Power
10
I
D
- Drain Current (A)
1 ms
1
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
0.01
0.1
*
V
GS
1
10
100
V
DS
- Drain-to-Source
Voltage
(V)
minimum
V
GS
at
which
R
DS(on)
is specified
BVDSS
Limited
1s
10 s
DC
Safe Operating Area, Junction-to-Ambient
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Document Number: 68606
S09-0704-Rev. B, 27-Apr-09
New Product
Si9926CDY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
12
3.5
3.0
10
I
D
- Drain Current (A)
8
Package Limited
Power (W)
0
25
50
75
100
125
150
2.5
2.0
1.5
1.0
6
4
2
0.5
0.0
25
50
75
100
125
150
0
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
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