SSM6N37FE
Electrical Characteristics
(Ta
=
25°C) (Q1, Q2 Common)
Characteristic
Drain-source breakdown voltage
Drain cutoff current
Gate leakage current
Gate threshold voltage
Forward transfer admittance
Symbol
V
(BR) DSS
V
(BR) DSX
I
DSS
I
GSS
V
th
|Y
fs
|
Test Condition
I
D
=
1 mA, V
GS
=
0 V
I
D
=
1 mA, V
GS
=
-10 V
V
DS
=
20 V, V
GS
=
0 V
V
GS
= ±10
V, V
DS
=
0 V
V
DS
=
3 V, I
D
=
1 mA
V
DS
=
3 V, I
D
=
100 mA
(Note 2)
Min
20
12
⎯
⎯
0.35
0.14
⎯
⎯
⎯
⎯
⎯
V
DS
=
10 V, V
GS
=
0 V, f
=
1 MHz
⎯
⎯
V
DD
=
10 V, I
D
=
100 mA
V
GS
=
0 to 2.5 V, R
G
=
50
Ω
I
D
=
-250 mA, V
GS
=
0 V
(Note 2)
⎯
⎯
⎯
Typ.
⎯
⎯
⎯
⎯
⎯
0.28
1.65
2.16
2.66
3.07
12
5.5
4.1
18
36
-0.9
Max
⎯
⎯
1
±1
1.0
⎯
2.20
3.02
4.05
5.60
⎯
⎯
⎯
⎯
⎯
-1.2
ns
V
pF
Ω
Unit
V
μA
μA
V
S
I
D
=
100 mA, V
GS
=
4.5 V (Note 2)
Drain-source ON-resistance
R
DS (ON)
I
D
=
50 mA, V
GS
=
2.5 V
I
D
=
20 mA, V
GS
=
1.8 V
I
D
=
10 mA, V
GS
=
1.5 V
Input capacitance
Output capacitance
Reverse transfer capacitance
Switching time
Turn-on time
Turn-off time
C
iss
C
oss
C
rss
t
on
t
off
V
DSF
(Note 2)
(Note 2)
(Note 2)
Drain-source forward voltage
Note 2: Pulse test
Switching Time Test Circuit
(Q1, Q2 Common)
(a) Test Circuit
2.5 V
0
10
μs
OUT
V
DD
=
10 V
R
G
=
50
Ω
Duty
≤
1%
V
IN
: t
r
, t
f
<
5 ns
Common Source
Ta
=
25°C
(b) V
IN
2.5 V
10%
90%
IN
R
G
0V
(c) V
OUT
V
DD
90%
10%
t
r
t
on
t
off
t
f
V
DD
V
DS (ON)
Precaution
Let V
th
be the voltage applied between gate and source that causes the drain current (I
D
) to be low (1mA for the
SSM6N37FE). Then, for normal switching operation, V
GS(on)
must be higher than V
th,
and V
GS(off)
must be lower than
V
th.
This relationship can be expressed as: V
GS(off)
< V
th
< V
GS(on).
Take this into consideration when using the device.
Do not use this device under avalanche mode. It may cause the device to break down.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
Thermal resistance R
th(j-a)
and drain power dissipation P
D
vary depending on board material, board area, board
thickness and pad area. When using this device, please take heat dissipation into consideration.
2
2014-03-01
SSM6N37FE
RESTRICTIONS ON PRODUCT USE
•
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in this document, and related hardware, software and systems (collectively "Product") without notice.
•
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
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•
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•
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•
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•
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•
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OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
5
2014-03-01
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