NC265
No Clean Liquid Flux
Features:
- Rosin and Resin-Free
- Halide-Free
- Broad Process Window
- Low Post Process Residues
-
Fast Wetting for SN100C and SAC alloys
- Lead-Free and Tin-Lead Compatible
®
Description:
NC265 is an alcohol-based no-clean liquid flux formulated to offer a very wide process window for lead-free and tin-lead
wave soldering operations. NC265 offers faster wetting for SN100C
®
and SAC alloys than previously formulated fluxes and
is compatible with a broad range of lead-free and tin-lead solder alloys. NC265 offers low post-process residues and has
proven to reduce preventative maintenance requirements for spray fluxing applications. NC265 is designed to be a no-clean,
non-visible residue flux, which can be cleaned if critical to the product application.
Application:
- NC265 is formulated for application via spray, foam, brush, mist, or dip. For spraying, NC265 is ready to use directly
from its container, no thinning required. When spray fluxing, it is imperative that proper flux coverage and uniformity be
achieved and maintained. A dry flux coating of 500-1500 micrograms per square inch is recommended as a starting point.
- When nitrogen sealed wave solder equipment is used, it is generally necessary to apply slightly more flux than normal as a
result of excess drying due to the extended length of the equipment.
- When foaming, air stones should be supplied with compressed air, free of oil and moisture. Adjust foam head to achieve
uniform bubble size for optimum coverage. During foaming applications, it is periodically necessary to add AIM’s
Common Flux Thinner to replace that which is lost due through evaporation.
Process Control:
Because of the low percentage of solids in this flux, control of specific gravity with automated equipment usually is found to
be ineffective; therefore, control via titration is necessary. AIM’s Titration Kit has proven to be cost-effective, user
friendly, quick and accurate. Titration should be carried out at least once an hour for flux foaming operations, or more often
if large variances are found.
Thermal Profile:
C
200
150
100
50
0
0
20
40
Sec
60
80
100
RATE of RISE
2-3 ºC / SEC MAX
PROGRESS THROUGH
66°C - 77°C ( 150 - 170ºF )
≤
40 SECONDS
PCB TOP SIDE TEMP
87°C - 115°C ( 190ºF - 240ºF )
JUST BEFORE WAVE
COOLDOWN
≤
4ºC
Cleaning:
NC265 can be cleaned, if necessary, with saponified water or an appropriate solvent cleaner. Please refer to the AIM No-
Clean-Cleaner Matrix for a list of suitable cleaning materials.
Handling:
-
NC265 has an unopened shelf life of 1 year when stored at room temperature.
- Do not store near fire or flame.
- Keep away from sunlight as it may degrade product.
- NC265 is shipped ready-to-use, no mixing necessary.
- Do not mix used and unused chemical in the same container.
- Reseal any opened containers.
Safety:
- Use with adequate ventilation and proper personal protective equipment.
- Refer to the accompanying Material Safety Data Sheet for any specific emergency information.
- Do not dispose of any hazardous materials in non-approved containers.
Physical Properties:
Parameter
J-STD-004
Visual
Odor
Solids Content
Acid Number
Value
ORL0
Clear, Colorless
Aromatic (Slightly)
4.05% ± 0.5
35.74 ± 2.13 mg KOH/gr flux
Parameter
Specific Gravity
Flash Point
Boiling Point
pH (1% solution /water)
Value
0.7976 ± 0.0087 (water = 1)
< 10°C
82°C
4.4012 ± 1.0212
Corrosion Testing:
Parameter
Copper Mirror (24 hrs @ 25°C, 50%RH)
Halide Test (Silver Chromate)
Requirements
IPC-TM-650-2.3.32
IPC-TM-650-2.2.33
R
esults
Low
Pass
Surface Insulation Resistance:
Reference
IPC-TM-650
method 2.6.3.3
85°C / 85% R.H.
Property
Control coupons
Sample coupons – pattern up
Sample coupons – pattern down
Post-test visual inspection
Pass-Fail Criteria
>1E+9 Ω at 96 and 168 hrs
>1E+8 Ω at 96 and 168 hrs
>1E+8 Ω at 96 and 168 hrs
No dendrite growth or corrosion
Results
3.15E+9 Ω and 3.02E+9 Ω Pass
3.03E+9 Ω and 2.93E+9 Ω Pass
4.26E+8 Ω and 6.03E+8 Ω Pass
Pass
Electromigration:
Test
Electromigration Bellcore
GR-78 Flux Requirements
Conditions
65°C/85% R.H. 500 hrs – Control
65°C/85% R.H. 500 hrs – Sample
Specification
Rf/Ri > 0.1
Rf/Ri > 0.1
Results
7.67E+10 Ω / 5.53E+10 Ω – Pass
1.69E+11 Ω / 2.30E+10 Ω – Pass
Canada +1-514-494-2000 · USA +1-401-463-5605 · Mexico +52-656-630-0032 · Europe +44-1737-222-258
Asia-Pacific +86-755-2993-6487 · India +91-80-41554753 · info@aimsolder.com · www.aimsolder.com
AIM IS ISO9001:2008 CERTIFIED
The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of
proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability is expressly
disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to
http://www.aimsolder.com/Home/TermsConditions.aspx
to review AIM's terms and conditions.
05/13
Document Rev # 7
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