®
Technical Data Sheet
44 Flux-Cored Wire
Product Description
Activated Rosin Cored Wire for Lead-Free and Leaded Alloys
Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. 44 has virtually dominated the field
of activated rosin core solders for well over five decades. An outstanding performance feature of this flux is the “instant-
action” wetting behavior. The high mobility and fast-spreading action of this flux results in more reliable production line
soldering. Under IPC J-STD-004, 44 is classified as ROM1. Despite the increased activity and soldering performance, 44
passes both 85°C/85% RH and 40°C/90% RH SIR test methods.
Performance Characteristics:
■
High activity RA formulation
■
Passes both 85°C/85% RH and
40°C/90% RH IPC SIR testing
■
Excellent solderability to a wide
range of metalizations
■
Industry standard RA cored wire for
decades
■
Classified as ROM1 per J-STD-004
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead
containing products at the user level. (Applies only if this core flux is combined with a lead-free alloy)
Reliability Properties
Copper Mirror Corrosion:
Moderate
Tested to J-STD-004, IPC-TM-650, Method
2.3.32
Chloride and Bromides:
0.44%
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.35
Tested to J-STD-004, IPC-TM-650, Method
2.6.35.1
Surface Insulation Resistance (SIR),
IPC (typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Test conditions: 85°C, 85% RH, 7 days, 100V
Corrosion Test:
Moderate
Silver Chromate:
Fail
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Tested to J-STD-004, IPC-TM-650, Method
2.6.33
Blank
Day 1
Day 4
Day 7
7.46*10 Ω
9
44
2.2*10
8
Ω
2.88*10
9
Ω
7.14*10
9
Ω
Surface Insulation Resistance (SIR)
40°C/90% RH, IPC (typical):
Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.7
4.9*10
9
Ω
7.7*10
9
Ω
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Availability
44 flux-cored wire is available in a wide variety of alloys, wire diameters, flux percentages and roll sizes in both leaded
and lead-free alloys. The most common alloys are Sn63Pb37 and Sn60Pb40. Please refer to
www.kester.com
for more
information.
Note: Core size 50, 58 and 66 = 1.1%, 2.2% and 3.3% flux core, respectively.
®
Process Considerations
Solder iron tip temperatures are most commonly between 315-343°C (600-650°F) for leaded alloys and 371-400°C (700-
750°F) for lead-free alloys. Heat both the land area and component lead to be soldered with the iron tip prior to applying
the solder wire to land area or component lead. Do not apply the wire directly to the soldering iron tip; doing so will shorten
the life of the soldering tip.
Additional liquid flux should only be used as a last resort. Any flux applied to the solder location should be kept to the area
of the connection being reworked. If needed, Kester 186 or Kester NF372-TB may be used as a compatible liquid fluxes
to aid in reworking soldered joints. Kester 186 and Kester NF372-TB are also available in Flux-Pens
®
for optimum board
cleanliness.
Cleaning
44 possesses excellent fluxing ability; the flux residues are non-corrosive, non-conductive and do not require removal for
most applications under normal conditions of use. IPA will not clean the residues off the surface of the circuit board after
the soldering process. If removal is required, a saponifier or cleaning agent specifically designed to clean a no-clean flux
is required to clean the residues. Please contact Kester Technical Support for further information.
Storage and Warranty Period
Storage must be in a dry, non-corrosive environment between 10-40°C (50-104°F). The surface may lose its shine and
appear a dull shade of grey. This is a surface phenomenon and is not detrimental to product functionality. Flux-cored
solder wire has a limited warranty period determined by the alloy used in the wire. For alloys containing more than 70%
lead, the warranty period is 2 years from the date of manufacture. Other alloys have a warranty period of 3 years from the
date of manufacture.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
TI Technology Forum
京公网安备 11010802033920号
EEWORLD
