|
TC74ACT139P |
TC74ACT139F |
TC74ACT139FN_07 |
TC74ACT139FN |
TC74ACT139FT |
Description |
CMOS Digital Integrated Circuit Silicon Monolithic Dual 2-to-4 Line Decoder |
CMOS Digital Integrated Circuit Silicon Monolithic Dual 2-to-4 Line Decoder |
CMOS Digital Integrated Circuit Silicon Monolithic Dual 2-to-4 Line Decoder |
CMOS Digital Integrated Circuit Silicon Monolithic Dual 2-to-4 Line Decoder |
CMOS Digital Integrated Circuit Silicon Monolithic Dual 2-to-4 Line Decoder |
Is it lead-free? |
Lead free |
Lead free |
- |
Lead free |
Lead free |
Is it Rohs certified? |
incompatible |
incompatible |
- |
conform to |
conform to |
Maker |
Toshiba Semiconductor |
Toshiba Semiconductor |
- |
Toshiba Semiconductor |
- |
Parts packaging code |
DIP |
SOIC |
- |
SOIC |
TSSOP |
package instruction |
DIP, DIP16,.3 |
0.300 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-16 |
- |
SOP, SOP16,.25 |
TSSOP, TSSOP16,.25 |
Contacts |
16 |
16 |
- |
16 |
16 |
Reach Compliance Code |
unknow |
unknow |
- |
unknow |
unknow |
ECCN code |
EAR99 |
EAR99 |
- |
EAR99 |
EAR99 |
series |
ACT |
ACT |
- |
ACT |
ACT |
Input adjustment |
STANDARD |
STANDARD |
- |
STANDARD |
STANDARD |
JESD-30 code |
R-PDIP-T16 |
R-PDSO-G16 |
- |
R-PDSO-G16 |
R-PDSO-G16 |
length |
19.25 mm |
10.3 mm |
- |
9.9 mm |
5 mm |
Load capacitance (CL) |
50 pF |
50 pF |
- |
50 pF |
50 pF |
Logic integrated circuit type |
OTHER DECODER/DRIVER |
OTHER DECODER/DRIVER |
- |
OTHER DECODER/DRIVER |
OTHER DECODER/DRIVER |
MaximumI(ol) |
0.024 A |
0.024 A |
- |
0.024 A |
0.024 A |
Number of functions |
2 |
2 |
- |
2 |
2 |
Number of terminals |
16 |
16 |
- |
16 |
16 |
Maximum operating temperature |
85 °C |
85 °C |
- |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
Output polarity |
INVERTED |
INVERTED |
- |
INVERTED |
INVERTED |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
SOP |
- |
SOP |
TSSOP |
Encapsulate equivalent code |
DIP16,.3 |
SOP16,.3 |
- |
SOP16,.25 |
TSSOP16,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
SMALL OUTLINE |
- |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
5 V |
5 V |
- |
5 V |
5 V |
Prop。Delay @ Nom-Su |
10.5 ns |
10.5 ns |
- |
10.5 ns |
10.5 ns |
propagation delay (tpd) |
10.5 ns |
10.5 ns |
- |
10.5 ns |
10.5 ns |
Certification status |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Maximum seat height |
4.45 mm |
1.9 mm |
- |
1.75 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
- |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
- |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
- |
5 V |
5 V |
surface mount |
NO |
YES |
- |
YES |
YES |
technology |
CMOS |
CMOS |
- |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
THROUGH-HOLE |
GULL WING |
- |
GULL WING |
GULL WING |
Terminal pitch |
2.54 mm |
1.27 mm |
- |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
- |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
width |
7.62 mm |
5.3 mm |
- |
3.9 mm |
4.4 mm |