Dual-Port SRAM, 256KX18, 3.6ns, CMOS, PQFP144, 20 X 20 MM X 1.4 MM, GREEN, TQFP-144
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | QFP |
package instruction | 20 X 20 MM X 1.4 MM, GREEN, TQFP-144 |
Contacts | 144 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 3.6 ns |
Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
Maximum clock frequency (fCLK) | 166 MHz |
I/O type | COMMON |
JESD-30 code | S-PQFP-G144 |
JESD-609 code | e3 |
length | 20 mm |
memory density | 4718592 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 18 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 144 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFQFP |
Encapsulate equivalent code | QFP144,.87SQ,20 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2.5,2.5/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.015 A |
Minimum standby current | 2.4 V |
Maximum slew rate | 0.45 mA |
Maximum supply voltage (Vsup) | 2.6 V |
Minimum supply voltage (Vsup) | 2.4 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 20 mm |
Base Number Matches | 1 |