LVQ SERIES, QUAD 2-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14
Parameter Name | Attribute value |
Maker | Texas Instruments |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 14 |
Reach Compliance Code | unknown |
Other features | 75 OHM INCIDENT WAVE SWITCHING |
series | LVQ |
JESD-30 code | R-PDIP-T14 |
length | 19.18 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | NAND GATE |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
propagation delay (tpd) | 8.5 ns |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
Base Number Matches | 1 |
74LVQ00PC | 54LVQ00FM | 54LVQ00DM | 54LVQ00LM | |
---|---|---|---|---|
Description | LVQ SERIES, QUAD 2-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14 | LVQ SERIES, QUAD 2-INPUT NAND GATE, CDFP14, CERAMIC, FP-14 | LVQ SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | IC LVQ SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20, Gate |
Parts packaging code | DIP | DFP | DIP | QLCC |
package instruction | DIP, | DFP, | DIP, | QCCN, |
Contacts | 14 | 14 | 14 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
series | LVQ | LVQ | LVQ | LVQ |
JESD-30 code | R-PDIP-T14 | R-GDFP-F14 | R-GDIP-T14 | S-CQCC-N20 |
length | 19.18 mm | 9.5885 mm | 19.43 mm | 8.89 mm |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
Number of functions | 4 | 4 | 4 | 4 |
Number of entries | 2 | 2 | 2 | 2 |
Number of terminals | 14 | 14 | 14 | 20 |
Maximum operating temperature | 85 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DFP | DIP | QCCN |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER |
propagation delay (tpd) | 8.5 ns | 9 ns | 9 ns | 9 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 2.032 mm | 5.08 mm | 1.905 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | QUAD |
width | 7.62 mm | 6.35 mm | 7.62 mm | 8.89 mm |
Maker | Texas Instruments | - | Texas Instruments | Texas Instruments |
Base Number Matches | 1 | 1 | 1 | - |