data sheet
Features:
LAMINATE
PBGA
Innovative designs and expanding package offerings provide
a platform from prototype-to-production.
• Custom ball counts up to 1521
• 1.00, 1.27 & 1.50 mm ball pitch available
• 13 mm to 40 mm body sizes
• Low Profile and lightweight
• Thermal and electrical enhancement capable
• Highly flexible internal routing of signal, power and ground
for device performance and system compatibility
• HDI designs possible
• Suitable substrate for multi-die and integrated SMT structures
• Mature strip based manufacturing process with high yields
• Full in-house design capability
• Quickest design-to-prototype delivery
• Perimeter, stagger and full ball arrays
• Special packaging for memory available
• Multi-layer, ground / power
• JEDEC MS-034 standard outlines
• Excellent reliability
• 63 Sn / 37 Pb Eutectic solder balls
Thermal Resistance:
Plastic Ball Grid Array
(PBGA):
Amkor’s PBGAs incorporate the most advanced
assembly processes and designs for today’s and
tomorrow’s cost/performance applications. This
advanced IC package technology allows application
and design engineers to optimize innovations
while maximizing the performance characteristics
of semiconductors. Amkor’s PBGAs are designed
for low inductance, improved thermal operation
and enhanced SMT ability. Custom performance
enhancements, like ground and power planes, are
available for significant improvements in electrical
response demanded by advancing electronics.
Additionally, these PBGAs utilize industry proven,
semiconductor grade materials for reliable, long-
term operations while providing the user flexible
design parameters.
Applications:
Semiconductor technologies find enhanced
performance by using the integrated design
features of Amkor’s PBGAs. Microprocessors /
controllers, ASICs, Gate Arrays, memory, DSPs,
PLDs, graphics and PC chip sets find Amkor’s
PBGA family to be an ideal package. Applications
requiring improved portability, form-factor/size
and high-performance such as cellular, wireless
telecommunications, PCMCIA cards, global posi-
tioning systems (GPS), laptop PC's, video cameras,
disc drives, PLDs, graphics and other similar
products benefit from Amkor's PBGA attributes.
Multi layer PCB, 0 air flow
Pkg
272
388
272
388
356* TE
452* TE
356**TE-2
452**TE-2
PCB
Cu
Theta JA
Body Size Layer Thickness (°C/W)
27.0 x 27.0
2
N/A
22
35.0 x 35.0
2
N/A
19
27.0 x 27.0
4
36
µm
19
35.0 x 35.0
4
36
µm
16
27.0 x 27.0
4
72
µm
16
35.0 x 35.0
4
72
µm
14
27.0 x 27.0
4
72
µm
13.5
35.0 x 35.0
4
72
µm
12
*TEPBGA **TEPBGA-2
Results dependent on body size, die size, and PCB design.
Reliability:
Amkor assures you reliable performance by continuously
monitoring key indices:
• Moisture sensitivity
JEDEC Level 3
characterization
30 °C/60% RH/192 hours
• High temp op life
125 °C, 6V, 1000 hours
• Autoclave or unbiased hast 130 °C/85% RH/96 hours
• High temp storage
150 °C, 1000 hours
• Temp cycle
-55/+125 °C, 1000 cycles
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS 520L
Rev Date: 05’07
data sheet
PBGA
PBGA Cross Section
LAMINATE
Process Highlights
Die thickness (max)
Bond pad pitch (min)
Marking
Ball inspection
Pack / Ship options
Wafer backgrinding
13 mils
2.4 mils
Laser
Optical
JEDEC trays, Dry pack
Available
PBGA Standard Package Offering (mm)
BODY
SIZE
BALL
COUNT
BALL
PITCH
BALL
MATRIX
BALL
DIAM.
PCB THICKNESS
2 LYR
4 LYR
MOLD
CAP
THK
TOTAL PACKAGE
THICKNESS
2 LYR
4LYR
13.0 x 13.0
14.0 x 22.0
15.0 x 15.0
17.0 x 17.0
19.0 x 19.0
23.0 x 23.0
27.0 x 27.0
31.0 x 31.0
35.0 x 35.0
37.5 x 37.5
40.0 x 40.0
144
119
153
121
156/160
196
192/208
256
240
289
324
169
208/217
240/249
289
288/324
484
225
256/272
300/316
356
400
416
676
304/329
360/385
529
516
900
313
352/388
420/456
452
809
580
680
1,156
524
784
564
900
1.0
1.27
1.27
1.27
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.50
1.27
1.27
1.27
1.00
1.00
1.50
1.27
1.27
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.27
1.27
1.00
1.00
1.00
1.27
1.27
1.27
1.27
12 x 12 F
7 x 17 F
9 x 17 F
11 x 11 F
14 x 14 P
14 x 14 F
16 x 16 P
16 x 16 F
18 x 18 P
17 x 17 P
18 x 18 P
13 x 13 F
17 x 17 P
17 x 17 P
17 x 17 F
22 x 22 P
22 x 22 F
15 x 15 F
20 x 20 P
20 x 20 P
20 x 20 P
20 x 20 F
26 x 26 P
26 x 26 F
23 x 23 P
23 x 23 P
23 x 23 F
30 x 30 P
30 x 30 F
25 x 25 S
26 x 26 P
26 x 26 P
26 x 26 P
26 x 26 F
34 x 34 P
34 x 34 P
34 x 34 F
28 x 28 P
28 x 28 F
30 x 30 P
30 x 30 F
0.51
0.76
0.76
0.76
0.51
0.51
0.51
0.51
0.51
0.51
0.51
0.76
0.76
0.76
0.76
0.63
0.63
0.76
0.76
0.76
0.76
0.76
0.63
0.63
0.76
0.76
0.76
0.63
0.63
0.76
0.76
0.76
0.76
0.76
0.63
0.63
0.63
0.76
0.76
0.76
0.76
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.32
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.52
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.80
0.90
0.90
1.17
0.80
0.80
0.80
0.80
0.80
0.80
0.80
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.52
1.82
1.82
2.09
1.52
1.52
1.52
1.52
1.52
1.52
1.52
2.09
2.09
2.09
2.09
1.99
1.99
2.09
2.09
2.09
2.09
2.09
1.99
1.99
2.29
2.29
2.29
2.19
2.19
2.29
2.29
2.29
2.29
2.29
2.19
2.19
2.19
2.29
2.29
2.29
2.29
1.76
2.06
2.06
2.33
1.76
1.76
1.76
1.76
1.76
1.76
1.76
2.33
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
2.33
2.33
2.23
2.23
2.23
2.33
2.33
2.33
2.33
Standard Materials
Package Substrate:
Die attach:
Au wire:
Mold compound:
Solder balls:
CCL-HL832
Ablestik 2300
25
µ
m or 30
µ
m
Nitto GE 100L
63 Sn / 37 Pb
Test Services
Program generation/conversion
Product engineering
Wafer sort
256 Pin x 20 MHz test system available
-55 °C to + 125 °C test available
Tape and Reel services
Burn-in
Shipping
Low profile tray (JEDEC Outline CO-029)
NOTE:
All measurements in mm.
P = Perimeter
F = Full Array
S = Stagger
= Maximum possible ball count (may not be
tooled). Additional depopulated options
are available. Contact account manager
for additional tooling.
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
Microcontroller MCU
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