data sheet
MQFP
Features:
LEADFRAME
Metric Quad Flat
Pack (MQFP)
Packages:
Amkor’s MQFP package portfolio enables
the designer, specifier or systems engineer
the flexibility of growing or shrinking IC
package size based upon application need.
Amkor employs the most up-to-date,
advanced equipment, material and
processes to assure successful, reliable
performance of your IC chips. Having a
complete line of MQFPs available and at
your disposal means security and conven-
ience. Sourcing them from Amkor means
success.
Thermal
Enhancement:
Some designs and applications require an
added margin of thermal performance
(power). Amkor’s easy and cost-effective
solution is a heatspreader. This optional
embedded thermal aid improves Theta JA
by greater than 15% (without external
heatsinks or fans) by increasing the heat
dissipation path from the IC chip to the
PCB.
Applications:
Amkor’s MQFP line is adapted to meet the
increasing challenges of advancing proces-
sors/controllers, DSP, ASIC, video-DAC, PC
chip-sets, gate arrays, logic, multi-media
and other technologies. These packages fill
many end application needs in consumer,
commercial, office, automotive, PC, indus-
trial and other product areas.
Amkor’s MQFP IC package portfolio provides:
• 10 x 10 mm to 40 x 40 mm body size
• 44 to 304 lead counts
• Hi-conductivity copper leadframes
• Die up and down configurations
• JEDEC standard compliant
• Wide selection of leadframe die pad sizes
• Integrated thermal enhancement
• Heatspreader available
• Custom leadframe design available
• Fine pitch wire bond capability
• Lead free option available
Multi-Layer PCB
Body
Pkg
Size (mm)
44 ld
10 x 10
64 ld
14 x 14
JEDEC Standard Test Boards
Thermal Resistance:
Pad Size
7.4 x 7.4
8.9 x 8.9
Theta JA (°C/W) by Velocity (LFPM)
0
38.4
33.7
200
32.1
27.9
500
29.4
25.5
Multi-Layer PCB
Body
Pkg
Size (mm)
**44 ld
10 x 10
**64 ld
14 x 14
*100 ld
14 x 20
*208 ld
28 x 28
*240 ld
32 x 32
*304 ld
40 x 40
* Pre-JEDEC Standard Test Boards
** JEDEC Standard Test Boards
Pad Size
7.4 x 7.4
8.9 x 8.9
11.0 x 11.0
11.0 x 11.0
12.7 x 12.7
11.0 x 11.0
Theta JA (°C/W) by Velocity (LFPM)
0
37.5
32.7
27.3
25.7
24.5
26.8
200
31.8
27.4
23.5
22.6
21.8
24.0
500
29.4
25.1
21.6
20.9
20.5
22.5
Electrical:
Body Size
Pkg
(mm) Lead
44 ld 10 x 10 Longest
Shortest
Simulated Results @ 100 MHz
Inductance
(nH)
1.660
1.460
Capacitance
(pF)
0.322
0.342
Resistance
(mΩ)
19.8
17.0
Reliability:
Amkor’s MQFPs are reliability assured through optimized design, material
and process enabling high performance operation of your IC chip.
• Moisture Sensitivity
Characterization
• PCT
• Temp cycle
• Temp/Humidity
• High temp storage
JEDEC Level 3
30 °C/60% RH, 192 hours
121 °C /100% RH/2 atm., 504 hours
-65/+150 °C, 1000 cycles
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS250G
Rev Date: 09’02
data sheet
Cross-sections MQFP
LEADFRAME
MQFP
Process Highlights
Die thickness (max)
25 mil
Solder plating
85/15 Sn/Pb
Marking
Pad/Laser
Lead inspection
Laser/Optical
Pack/ship options
Bar code, dry pack
Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
• 256 pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in
• Tape and reel services
Shipping
JEDEC outline CS-004 low profile tray
• Bakable (125 °C and 150 °C)
• Non-bakable
MQFP w/Drop-in AI Heat Spreader
Configuration Options:
MQFP NOMINAL PACKAGE DIMENSIONS (mm)
Body
Size
10 x 10
10 x 10
14 x 14
14 x 14
14 x 14
14 x 20
14 x 20
28 x 28
28 x 28
28 x 28
32 x 32
32 x 32
40 x 40
Body
Tkns
2.00
2.00
2.00
2.67
2.67
2.71
2.71
3.37
3.37
3.37
3.40
3.40
3.80
Lead
Form
1.60
1.95
1.60
1.60
1.95
1.60
1.95
1.30
1.30
1.60
1.30
1.30
1.30
Standoff
0.15
0.15
0.15
0.15
0.15
0.33
0.23
0.13
0.33
0.33
0.38
0.32
0.43
Tip To
Tip
13.2
13.9
17.2
17.2
17.9
17.2 x 23.2
17.9 x 23.9
30.6
30.6
31.2
34.6
34.6
42.6
Lead
Count
44/52/64
44/52/64
52/64/80/100
52/64/80/100
52/64/80/100
64/80/100/128
64/80/100/128
208/256
120/128/144/160/208
120/128/144/160/208
240
240
304
JEDEC
MS-022
MO-112
MS-022
MS-022
MO-112
MS-022
MO-112
MS-029
MS-029
MS-022
MS-029
MS-029
MS-029
Tray
Matrix
6 x 16
6 x 16
6 x 14
6 x 14
6 x 14
6 x 11
6 x 11
3x8
3x8
3x8
3x8
3x8
2x6
Units
Per Tray
96
96
84
84
84
66
66
24
24
24
24
24
12
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
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