HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series
Motion Sensing Products, Optical Encoder Modules
Reliability Data
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accord-
ance with the latest revision of MIL- STD-883.
Avago tests parts at the absolute maximum rated con-
ditions recommended for the device. The actual per-
formance you obtain from Avago parts depends on the
electrical and environmental characteristics of your ap-
plication but will probably be better than the perform-
ance outlined in Table .
Failure Rate Prediction
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relation-
ship between ambient temperature and actual junction
temperature is given by the following:
T
J
(°C) = T
A
(°C) +
θ
JA
P
AVG
where
T
A
= ambient temperature in °C
θ
JA
= thermal resistance of
junction-to-ambient in °C/watt
P
AVG
= average power dissipated in watts
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature ac-
celeration. Results of such calculations are shown in the
table on the following page using an activation energy of
0.43 eV (reference MIL-HDBK-27).
Table 1. Life Tests
Demonstrated Performance
Point Typical Performance
Test Name
High Temperature
Operating Life
Stress Test
Conditions
V
CC
= 5.5 V,
V
A
= V
B
= 3.5 V
T
A
= 00°C
000 hours
V
CC
= 5.5 V
V
A
= V
B
= 3.5 V
,000 hours
T
A
= 85°C
RH = 85%
Total
Device Hrs.
,405,000
Units
Tested
,405
Total
Failed
2
MTBF
702,500
Failure Rate
(% /1K Hours)
0.42
Temperature
Humidity
Operating Life
,495,000
,495
0
49,500
0.669
Table 2.
Point Typical Performance
[1]
in Time
Ambient
Temperature (°C)
+00
+90
+80
+70
+60
+50
+40
+30
+20
Junction
Temperature (°C)
+0
+00
+90
+80
+70
+60
+50
+40
+30
MTBF
[1]
Performance in Time
[2]
(90% Confidence)
MTBF
[2]
Failure Rate
(%/1K Hours)
0.42
0.00
0.069
0.047
0.03
0.020
0.03
0.008
0.005
Failure Rate
(%/1K Hours)
0.379
0.267
0.85
0.25
0.083
0.054
0.034
0.02
0.02
703,000
996,000
,440,000
2,26,000
3,20,000
4,968,000
7,90,000
2,942,000
2,903,000
264,000
374,000
54,000
799,000
,206,000
,867,000
2,969,000
4,863,000
8,230,000
Notes:
. The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number of failures. In the case of zero
failures, one failure is assumed for this calculation.
2. The 90% Confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all samples. This confidence
interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is
commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology.
3. Failures are catastrophic or parametric. Catastrophic failures are open, short, no logic output, no dynamic parameters while parametric failures
are failures to meet an electrical characteristic as specified in product catalog such as output voltage, duty or state errors.
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 68 hours/week is:
(8 hours/day) x (5 days/week) / (68 hours/week) = 0.25
The point failure rate per year (8760 hours) at 50°C ambient temperature is:
(0.020% / K hours) x 0.25 x (8760 hours/year) = 0.044% per year
Similarly, 90% confidence level failure rate per year at 50°C:
(0.054% / K hours) x 0.25 x (8760 hours/year) = 0.8% per year
2
Table 3. Environmental Tests
Test Name
Temperature Cycle
MIL-STD-883C
Reference
00
Test Conditions
-40°C to +00°C, 5 minute dwell,
5 minute transfer,
5 cycles
200 cycles
500 cycles
Sn/Pb 60/40 Solder; 260°C peak;
0 sec., 20 temp cycles @ -40°C to 85°C
T
A
= +05°C
2,000 hours
Units
Tested
Units
Failed
9,52
,570
,570
38
77
0
3
9
0
0
Solder Heat Resistance
High Temperature
Storage Life
2003
N/A
Table 4. Mechanical Tests
Test Name
Mechanical Shock
Vibration Variable Frequency
MIL-STD-883C
Reference
2002
2007
Test Conditions
5 blows; X, Y, Z axes, 500 g, 0.5 msec.
3 cycles, 4 min. each X, Y, Z axes, 20 g min.
20 to 2000 Hz
5 to 000 Hz
3 bends, 5° minimum
Units
Tested
5
26
0
5
5
Units
Failed
0
0
0
0
0
Terminal Strength
Lead Fatigue
2004 Condition A lb. for 30 seconds
2004, Cond. B
Table 5. Electrical Tests
Test Name
ESD - Human Body Model
MIL-STD-883C
Reference
305.2
Test Conditions
.5 KΩ, 00 pF, 5 positive and 5 negative dis-
charges per pin. V
Z
= 3.0 KV
Units
Tested
35
Units
Failed
0
3
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
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