74CBTLVD3244BQ datasheet, PDF - EEWORLD Datasheet

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74CBTLVD3244BQ: DescriptionDUAL 4-CHANNEL, FOUR POLE SGL THROW SWITCH, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20; CategoryThe signal circuit; File Size433KB，20 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74CBTLVD3244BQ Overview

DUAL 4-CHANNEL, FOUR POLE SGL THROW SWITCH, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20

74CBTLVD3244BQ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFN
package instruction	2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
Contacts	20
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	4PST
JESD-30 code	R-PQCC-N20
length	4.5 mm
Humidity sensitivity level	1
Number of channels	4
Number of functions	2
Number of terminals	20
Maximum on-state resistance (Ron)	12 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
Maximum disconnect time	8 ns
Maximum connection time	6 ns
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	2.5 mm
Base Number Matches	1

74CBTLVD3244BQ Related Products

	74CBTLVD3244BQ	74CBTLVD3244DS	74CBTLVD3244PW
Description	DUAL 4-CHANNEL, FOUR POLE SGL THROW SWITCH, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20	DUAL 4-CHANNEL, FOUR POLE SGL THROW SWITCH, PDSO20, 3.90 MM, 0.635 MM PITCH, PLASTIC, MO-137, SOT724-1, SSOP-20	DUAL 4-CHANNEL, FOUR POLE SGL THROW SWITCH, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
Is it Rohs certified?	conform to	conform to	conform to
Maker	NXP	NXP	NXP
Parts packaging code	QFN	SSOP	TSSOP
package instruction	2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20	3.90 MM, 0.635 MM PITCH, PLASTIC, MO-137, SOT724-1, SSOP-20	4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
Contacts	20	20	20
Reach Compliance Code	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	4PST	4PST	4PST
JESD-30 code	R-PQCC-N20	R-PDSO-G20	R-PDSO-G20
length	4.5 mm	8.7 mm	6.5 mm
Humidity sensitivity level	1	1	1
Number of channels	4	4	4
Number of functions	2	2	2
Number of terminals	20	20	20
Maximum on-state resistance (Ron)	12 Ω	12 Ω	12 Ω
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	SSOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	1.73 mm	1.1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
Maximum disconnect time	8 ns	8 ns	8 ns
Maximum connection time	6 ns	6 ns	6 ns
technology	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	NO LEAD	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.635 mm	0.65 mm
Terminal location	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30
width	2.5 mm	3.9 mm	4.4 mm
Base Number Matches	1	1	1
JESD-609 code	-	e4	e4
Terminal surface	-	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD

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