FIFO, 512X9, 15ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | DIP |
package instruction | 0.600 INCH, PLASTIC, DIP-28 |
Contacts | 28 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 15 ns |
Other features | RETRANSMIT |
period time | 25 ns |
JESD-30 code | R-PDIP-T28 |
JESD-609 code | e3 |
length | 36.576 mm |
memory density | 4608 bit |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 512 words |
character code | 512 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512X9 |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 4.699 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 15.24 mm |
Base Number Matches | 1 |