ESD >2000V per MIL-STD-883, Method 3015; >200V using
machine model (C = 200pF, R = 0)
• Available in TSSOP package
DESCRIPTION:
The CBTLV16245 is a set of 16-bit bus switches. It has standard 16245
pinouts. The device is organized as dual 8-bit low resistance switches with
independent Output Enable (xOE) control inputs. The switches can be
turned on under the control of the LVTTL-compatible Output Enable signals
(xOE) for bidirectional data flow between port A and port B. When xOE is
high, the switch is off and a high impedance exists between Port A and Port
B.
To ensure the high-impedance state during power up or power down,
OE
should be tied to V
CC
through a pullup resistor.
APPLICATIONS:
• 3.3V High Speed Bus Switching and Bus Isolation
FUNCTIONAL BLOCK DIAGRAM
SIMPLIFIED SCHEMATIC, EACH
SWITCH
47
1A1
SW
2
1B1
A
1A8
37
SW
12
1B8
B
48
1OE
OE
36
2A1
SW
13
2B1
2A8
26
SW
23
2B8
25
2OE
INDUSTRIAL TEMPERATURE RANGE
1
c
2019 Integrated Device Technology, Inc.
MAY 2019
DSC-5885/11
74CBTLV16245
LOW-VOLTAGE 16-BIT BUS SWITCH
INDUSTRIAL TEMPERATURE RANGE
PIN CONFIGURATION
NC
1
B
1
1
B
2
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
CC
Description
Supply Voltage Range
Input Voltage Range
Continuous Channel Current
I
IK
T
STG
Input Clamp Current, V
I/O
< 0
Storage Temperature Range
Max.
–0.5 to 4.6
–0.5 to 4.6
128
–50
–65 to +150
Unit
V
V
mA
mA
°C
1
2
3
4
5
6
7
8
9
1
0
1
1
1
2
1
3
1
4
1
5
1
6
1
7
1
8
1
9
2
0
2
1
2
2
2
3
2
4
4
8
4
7
4
6
4
5
4
4
4
3
4
2
4
1
4
0
3
9
3
8
3
7
3
6
3
5
3
4
3
3
3
2
3
1
3
0
2
9
2
8
2
7
2
6
2
5
1OE
1
A
1
1
A
2
V
I
NC
1
B
3
1
B
4
NC
1
A
3
1
A
4
NC
1
B
5
1
B
6
NC
1
A
5
1
A
6
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
GND
1
B
7
1
B
8
2
B
1
2
B
2
GND
1
A
7
1
A
8
2
A
1
2
A
2
PIN DESCRIPTION
Pin Names
xOE
xAx
xBx
Description
Output Enable (Active LOW)
Port A Inputs or Outputs
Port B Inputs or Outputs
GND
2
B
3
2
B
4
GND
2
A
3
2
A
4
V
CC
2
B
5
2
B
6
V
CC
2
A
5
2
A
6
GND
2
B
7
2
B
8
GND
2
A
7
2
A
8
FUNCTION TABLE
(EACH 8-BIT BUS SWITCH)
(1)
Input
OE
L
H
NOTE:
1. H = HIGH Voltage Level
L = LOW Voltage Level
NC
2OE
Operation
A-Port = B-Port
Disconnect
TOP VIEW
Package Type
TSSOP
Package Code
PAG48
Order Code
PAG
OPERATING CHARACTERISTICS
(1)
Symbol
V
CC
V
IH
V
IL
T
A
Parameter
Supply Voltage
High-Level Control Input Voltage
Low-Level Control Input Voltage
Operating Free-Air Temperature
V
CC
= 2.3V to 2.7V
V
CC
= 2.7V to 3.6V
V
CC
= 2.3V to 2.7V
V
CC
= 2.7V to 3.6V
NOTE:
1. All unused control inputs of the device must be held at V
CC
or GND to ensure proper device operation.
Test Conditions
Min.
2.3
1.7
2
—
—
–40
Max.
3.6
—
—
0.7
0.8
+85
Unit
V
V
V
°C
2
74CBTLV16245
LOW-VOLTAGE 16-BIT BUS SWITCH
INDUSTRIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Operating Condition: T
A
= –40°C to +85°C
Symbol
V
IK
I
I
I
OZ
I
OFF
I
CC
ΔI
CC(2)
C
I
C
IO(OFF)
Max. at V
CC
= 2.3V
Typ. at V
CC
= 2.5V
R
ON(3)
V
CC
= 3V
V
I
= 2.4V
NOTES:
1. Typical values are at 3.3V, +25°C ambient.
2. The increase in supply current is attributable to each input that is at the specified voltage level rather than V
CC
or GND.
3. This is measured by the voltage drop between the A and B terminals at the indicated current through the switch.
Parameter
Control Inputs, Data I/O
Control Inputs
Data I/O
Test Conditions
V
CC
= 3V, I
I
= –18mA
V
CC
= 3.6V, V
I
= V
CC
or GND
V
CC
= 3.6V, V
O
= 0V or 3.6V switch disabled
V
CC
= 0V, V
I
or V
O
= 0V or 3.6V
V
CC
= 3.6V, I
O
= 0, V
I
= V
CC
or GND
Min.
—
—
—
—
—
—
—
—
I
O
= 64mA
I
O
= 24mA
I
O
= 15mA
I
O
= 64mA
I
O
= 24mA
I
O
= 15mA
—
—
—
—
—
—
Typ.
(1)
—
—
—
—
—
—
4
9
5
5
27
5
5
10
Max.
–1.2
±1
5
10
10
300
—
—
8
8
40
7
7
15
Unit
V
µA
µA
µA
µA
µA
pF
pF
Control Inputs
Control Inputs
V
CC
= 3.6V, one input at 3V, other inputs at V
CC
or GND
V
I
= 3V or 0
V
O
= 3V or 0,
OE
= V
CC
V
I
= 0
V
I
= 1.7V
V
I
= 0
Ω
SWITCHING CHARACTERISTICS
V
CC
= 2.5V ± 0.2V
Symbol
t
PD(1)
t
EN
t
DIS
Propagation Delay
A to B or B to A
Output Enable Time
OE
to A or B
Output Disable time
OE
to A or B
NOTE:
1. The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance when driven by an ideal voltage source
(zero output impededance).
V
CC
= 3.3V ± 0.3V
Min.
—
1
1
Max.
0.25
4.5
5
Unit
ns
ns
ns
Parameter
Min.
—
1
1
Max.
0.15
5
5.5
3
74CBTLV16245
LOW-VOLTAGE 16-BIT BUS SWITCH
INDUSTRIAL TEMPERATURE RANGE
TEST CIRCUITS AND WAVEFORMS
TEST CONDITIONS
Symbol
V
LOAD
V
IH
V
T
V
LZ
V
HZ
C
L
V
CC(1)
= 3.3V±0.3V
6
3
1.5
300
300
50
V
CC(2)
= 2.5V±0.2V
2 x Vcc
Vcc
Vcc / 2
150
150
30
Unit
V
V
V
mV
mV
pF
SAME PHASE
INPUT TRANSITION
t
PLH
OUTPUT
t
PLH
OPPOSITE PHASE
INPUT TRANSITION
t
PHL
t
PHL
V
IH
V
T
0V
V
OH
V
T
V
OL
V
IH
V
T
0V
Propagation Delay
V
CC
500Ω
Pulse
Generator
(1, 2)
V
LOAD
Open
GND
CONTROL
INPUT
ENABLE
DISABLE
V
IN
D.U.T.
R
T
V
OUT
t
PZL
OUTPUT
SWITCH
NORMALLY
CLOSED
LOW
t
PZH
OUTPUT
SWITCH
NORMALLY
OPEN
HIGH
V
LOAD/2
V
T
t
PHZ
V
T
0V
t
PLZ
V
IH
V
T
0V
V
LOAD/2
V
OL +
V
LZ
V
OL
V
OH
V
OH -
V
HZ
0V
500Ω
C
L
Test Circuits for All Outputs
DEFINITIONS:
C
L
= Load capacitance: includes jig and probe capacitance.
R
T
= Termination resistance: should be equal to Z
OUT
of the Pulse Generator.
NOTES:
1. Pulse Generator for All Pulses: Rate
≤
10MHz; t
F
≤
2.5ns; t
R
≤
2.5ns.
2. Pulse Generator for All Pulses: Rate
≤
10MHz; t
F
≤
2ns; t
R
≤
2ns.
NOTE:
1. Diagram shown for input Control Enable-LOW and input Control Disable-HIGH.
Enable and Disable Times
SWITCH POSITION
Test
t
PLZ
/t
PZL
t
PHZ
/t
PZH
t
PD
Switch
V
LOAD
GND
Open
4
74CBTLV16245
LOW-VOLTAGE 16-BIT BUS SWITCH
INDUSTRIAL TEMPERATURE RANGE
ORDERING INFORMATION
XXX
XX
CBTLV
XX
Device Type Package
Temp. Range
X
X
Blank
8
G
PA
16245
Tube
Tape and Reel
Green
Thin Shrink Small Outline Package (PAG48)
Low-Voltage 16-Bit Bus Switch
74
–40°C to +85°C
Orderable Part Information
Speed
(ns)
Orderable Part ID
74CBTLV16245PAG
74CBTLV16245PAG8
Pkg.
Code
PAG48
PAG48
Pkg.
Type
TSSOP
TSSOP
Temp.
Grade
I
I
Datasheet Document History
12/04/2014
05/06/2019
Pg. 1,2,5
Pg. 2,6
Updated the ordering information by removing the "IDT" notation, obsolete package "TVSOP" and non RoHS
part and by adding Tape and Reel information.
Added table under pin configuration diagram with detailed package information and orderable part information table. Updated
the ordering information diagram in clearer detail.
This document describes how to modify the user area size of the iTOP-4418 development board. The partition data in the document is for16G eMMC.uboot settingsEnter the iTOP-4418 uboot, as shown below.E...
I have never understood where the global variables are stored when Keil is compiled. Today, I tried it in the program. After defining several global variables, the size of the code area has not change...
When we play racing games on the computer, the player's perspective is usually above or behind the car, so we can see the surrounding environment of the car. This perspective can help us understand th...
"High-Speed Circuit Design Practice" starts from the perspective of design practice, introduces the various technologies and skills that need to be mastered in the work of high-speed circuit design, c...
[i=s]This post was last edited by Beifang on 2021-12-21 16:22[/i]1. After several rounds of testing, it is basically confirmed that there is a problem with this module. If it is not a problem with the...
I recently bought a NanoPi M1 board from FriendlyArm, and applied for a NanoPi NEO board online. Both are Crotex-A7 quad-core ARM development boards based on the Allwinner H3 chip. The two boards can...[Details]
According to Jiwei.com, four months earlier than generally predicted by the industry, CCTV had announced a few days ago that 5G licenses would be issued in the near future. Sure enough, today, on Jun...[Details]
At the debugging site, we often encounter a motor without a nameplate, but we really want to know the speed of the motor, we don’t have a tachometer, and we don’t want to take the effort to disassemb...[Details]
This series of tutorials takes AVR microcontroller as the object and introduces the rapid development method of microcontroller. Reference textbook: "Microcontroller Technology and Application Proj...[Details]
Wall Street analysts believe that Apple's latest iPhone is expected to sell around 200 million units, driven by demand from current users to replace old phones with new ones, with most of the demand ...[Details]
The ZC-8 ground resistance meter is made according to the principle of compensation method, with a hand-cranked AC generator as the power source. Its working principle is shown in the figure. In Fig...[Details]
In the fourth quarter of 2019, MLCC prices gradually bottomed out along with the electronics industry, and inventory levels dropped to a healthy level of 70 days. Currently, in terms of global MLCC s...[Details]
The latest data from market research firm Strategy Analytics shows that under the strong momentum of 5G, the global baseband market revenue reached US$7.4 billion in the first quarter of 2021, a year...[Details]
1. Use proteus to draw a simple circuit diagram for subsequent simulation 2. Programming /*********************************************************************************************************...[Details]
China Energy Storage Network News:
Blockchain is expected to serve as an important breakthrough for independent innovation in core technologies, accelerating the development of technological ...[Details]
Recently, Guangzhou, which is blessed by the "Dragon Boat Water", always has heavy rain at the right or wrong time. Whenever this happens, the cars on the road seem to enter "slow mode", not only dri...[Details]
The production process of epitaxial wafers is very complicated. After the epitaxial wafers are developed, nine points are randomly selected from each
epitaxial wafer
for testing. The on...[Details]
When using ARM chips for bare metal development, memory management functions are often required. We can use our own memory management program or directly use the standard library. However, I gener...[Details]
High-quality 150mm diameter SiC substrates have been realized. We will use these substrates to start production of "trench type" SiC MOSFETs in 2015 . At CEATEC JAPAN 2013, Denso demonstrated SiC-re...[Details]
The industrial robot control system is the brain of the industrial robot, which is responsible for receiving input signals, processing information, controlling the robot's movement and performing t...[Details]