PBGA-119, Reel
Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | PBGA |
package instruction | BGA, |
Contacts | 119 |
Manufacturer packaging code | BGG119 |
Reach Compliance Code | compliant |
Maximum access time | 5 ns |
Other features | PIPELINED ARCHITECTURE |
JESD-30 code | R-PBGA-B119 |
JESD-609 code | e1 |
length | 22 mm |
memory density | 9437184 bit |
Memory IC Type | ZBT SRAM |
memory width | 18 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 119 |
word count | 524288 words |
character code | 512000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX18 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Maximum seat height | 2.36 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
Base Number Matches | 1 |