IC,BUFFER/DRIVER,SINGLE,9-BIT,F-TTL,DIP,24PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | DIP, DIP24,.3 |
Reach Compliance Code | unknown |
Control type | ENABLE LOW |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.064 A |
Number of digits | 9 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | 3-STATE |
Output polarity | INVERTED |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
method of packing | TAPE AND REEL |
power supply | 5 V |
Prop。Delay @ Nom-Sup | 4.5 ns |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
74FR9240SPCX | 74FR9240SCQRX | 74FR9240SPCQRX | |
---|---|---|---|
Description | IC,BUFFER/DRIVER,SINGLE,9-BIT,F-TTL,DIP,24PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,9-BIT,F-TTL,SOP,24PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,9-BIT,F-TTL,DIP,24PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
package instruction | DIP, DIP24,.3 | SOP, SOP24,.4 | DIP, DIP24,.3 |
Reach Compliance Code | unknown | unknown | unknown |
Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW |
JESD-30 code | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 |
JESD-609 code | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.064 A | 0.064 A | 0.064 A |
Number of digits | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Output polarity | INVERTED | INVERTED | INVERTED |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | DIP |
Encapsulate equivalent code | DIP24,.3 | SOP24,.4 | DIP24,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE |
method of packing | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
power supply | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 4.5 ns | 4.5 ns | 4.5 ns |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO |
technology | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 |