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IDT72T72115L5BBGI

Description
FIFO, 128KX72, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-324
Categorystorage    storage   
File Size453KB,53 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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IDT72T72115L5BBGI Overview

FIFO, 128KX72, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-324

IDT72T72115L5BBGI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA, BGA324,18X18,40
Contacts324
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time3.6 ns
Other featuresASYNCHRONOUS OPERATION ALSO POSSIBLE
Maximum clock frequency (fCLK)200 MHz
period time5 ns
JESD-30 codeS-PBGA-B324
JESD-609 codee1
length19 mm
memory density9437184 bit
Memory IC TypeOTHER FIFO
memory width72
Humidity sensitivity level3
Number of functions1
Number of terminals324
word count131072 words
character code128000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX72
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5 V
Certification statusNot Qualified
Maximum seat height1.97 mm
Maximum standby current0.02 A
Maximum slew rate0.13 mA
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
Base Number Matches1
2.5 VOLT HIGH-SPEED TeraSync
TM
FIFO 72-BIT CONFIGURATIONS
16,384 x 72, 32,768 x 72,
65,536 x 72, 131,072 x 72
IDT72T7285, IDT72T7295,
IDT72T72105, IDT72T72115
FEATURES:
Choose among the following memory organizations:
IDT72T7285
16,384 x 72
IDT72T7295
32,768 x 72
IDT72T72105
65,536 x 72
IDT72T72115
131,072 x 72
Up to 225 MHz Operation of Clocks
User selectable HSTL/LVTTL Input and/or Output
Read Enable & Read Clock Echo outputs aid high speed operation
User selectable Asynchronous read and/or write port timing
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input disables Write Port HSTL inputs
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
User selectable input and output port bus-sizing
- x72 in to x72 out
- x72 in to x36 out
- x72 in to x18 out
- x36 in to x72 out
- x18 in to x72 out
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 324-pin (19mm x 19mm)Plastic Ball Grid Array (PBGA)
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts are available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
D
0
-D
n
(x72, x36 or x18)
WEN
WCLK/WR
WCS
LD
SEN
SCLK
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
ASYW
WRITE CONTROL
LOGIC
WRITE POINTER
BE
IP
BM
IW
OW
MRS
PRS
TCK
TRST
TMS
TDO
TDI
Vref
WHSTL
RHSTL
SHSTL
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
RAM ARRAY
16,384 x 72
32,768 x 72
65,536 x 72
131,072 x 72
FLAG
LOGIC
READ POINTER
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
MARK
ASYR
JTAG CONTROL
(BOUNDARY SCAN)
RCLK/RD
REN
RCS
HSTL I/0
CONTROL
OE
EREN
5994 drw01
Q
0
-Q
n
(x72, x36 or x18)
ERCLK
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
FEBRUARY 2009
DSC-5994/15

IDT72T72115L5BBGI Related Products

IDT72T72115L5BBGI IDT72T7285L4-4BBG IDT72T7295L4-4BBG
Description FIFO, 128KX72, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-324 FIFO, 16KX72, 3.4ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-324 FIFO, 32KX72, 3.4ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-324
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA
package instruction BGA, BGA324,18X18,40 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40
Contacts 324 324 324
Reach Compliance Code compliant compliant compliant
ECCN code EAR99 EAR99 EAR99
Maximum access time 3.6 ns 3.4 ns 3.4 ns
Other features ASYNCHRONOUS OPERATION ALSO POSSIBLE ASYNCHRONOUS OPERATION ALSO POSSIBLE ASYNCHRONOUS OPERATION ALSO POSSIBLE
Maximum clock frequency (fCLK) 200 MHz 225 MHz 225 MHz
period time 5 ns 4.44 ns 4.44 ns
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e1 e1 e1
length 19 mm 19 mm 19 mm
memory density 9437184 bit 1179648 bit 2359296 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO
memory width 72 72 72
Humidity sensitivity level 3 3 3
Number of functions 1 1 1
Number of terminals 324 324 324
word count 131072 words 16384 words 32768 words
character code 128000 16000 32000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C
organize 128KX72 16KX72 32KX72
Exportable YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260
power supply 2.5 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.97 mm 1.97 mm 1.97 mm
Maximum standby current 0.02 A 0.02 A 0.02 A
Maximum slew rate 0.13 mA 0.13 mA 0.13 mA
Maximum supply voltage (Vsup) 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30
width 19 mm 19 mm 19 mm
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