|
74HC4066PW-Q100 |
74HCT4066PW-Q100,1 |
74HC4066D-Q100,118 |
74HC4066PW-Q100,11 |
P0805Z2803WNT |
Description |
Differential Multiplexer |
IC MUX/DEMUX 16CH ANLG 14TSSOP |
IC MUX/DEMUX 16CH ANLG 14SOIC |
IC MUX/DEMUX 16CH ANLG 14TSSOP |
Fixed Resistor, Thin Film, 0.2W, 280000ohm, 150V, 0.05% +/-Tol, 5ppm/Cel, Surface Mount, 0805, CHIP |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
package instruction |
, |
TSSOP, |
SOP-14 |
TSSOP, |
CHIP |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
Terminal surface |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
TIN SILVER OVER NICKEL |
Maker |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
- |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
- |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
- |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Base Number Matches |
1 |
1 |
1 |
1 |
- |
Brand Name |
- |
Nexperia |
Nexperia |
Nexperia |
- |
Parts packaging code |
- |
TSSOP |
SOIC |
TSSOP |
- |
Contacts |
- |
14 |
14 |
14 |
- |
Manufacturer packaging code |
- |
SOT402-1 |
SOT108-1 |
SOT402-1 |
- |
Analog Integrated Circuits - Other Types |
- |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
- |
JESD-30 code |
- |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
- |
length |
- |
5 mm |
8.65 mm |
5 mm |
- |
Number of channels |
- |
1 |
1 |
1 |
- |
Number of functions |
- |
4 |
4 |
4 |
- |
Number of terminals |
- |
14 |
14 |
14 |
2 |
Nominal off-state isolation |
- |
50 dB |
50 dB |
50 dB |
- |
On-state resistance matching specifications |
- |
5 Ω |
5 Ω |
5 Ω |
- |
Maximum on-state resistance (Ron) |
- |
142 Ω |
142 Ω |
142 Ω |
- |
Maximum operating temperature |
- |
125 °C |
125 °C |
125 °C |
155 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
-40 °C |
-55 °C |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
encapsulated code |
- |
TSSOP |
SOP |
TSSOP |
- |
Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
Package form |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMT |
Maximum seat height |
- |
1.1 mm |
1.75 mm |
1.1 mm |
- |
Maximum supply voltage (Vsup) |
- |
5.5 V |
10 V |
10 V |
- |
Minimum supply voltage (Vsup) |
- |
4.5 V |
2 V |
2 V |
- |
Nominal supply voltage (Vsup) |
- |
5 V |
5 V |
5 V |
- |
surface mount |
- |
YES |
YES |
YES |
YES |
Maximum disconnect time |
- |
53 ns |
225 ns |
225 ns |
- |
Maximum connection time |
- |
36 ns |
150 ns |
150 ns |
- |
Temperature level |
- |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
- |
Terminal form |
- |
GULL WING |
GULL WING |
GULL WING |
- |
Terminal pitch |
- |
0.65 mm |
1.27 mm |
0.65 mm |
- |
Terminal location |
- |
DUAL |
DUAL |
DUAL |
- |
width |
- |
4.4 mm |
3.9 mm |
4.4 mm |
- |