|
74HC4066PW |
74HCT4066BQ |
74HCT4066DB |
74HC4066D |
74HCT4066PW |
74HC4066BQ |
Description |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
package instruction |
TSSOP, |
DHVQFN-14 |
SSOP, |
SOP, |
TSSOP, |
DHVQFN-14 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
JESD-30 code |
R-PDSO-G14 |
R-PQCC-N14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PQCC-N14 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
5 mm |
3 mm |
6.2 mm |
8.65 mm |
5 mm |
3 mm |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
Number of channels |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
4 |
4 |
4 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
14 |
Nominal off-state isolation |
50 dB |
50 dB |
50 dB |
50 dB |
50 dB |
50 dB |
On-state resistance matching specifications |
5 Ω |
5 Ω |
5 Ω |
5 Ω |
5 Ω |
5 Ω |
Maximum on-state resistance (Ron) |
142 Ω |
142 Ω |
142 Ω |
142 Ω |
142 Ω |
142 Ω |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
HVQCCN |
SSOP |
SOP |
TSSOP |
HVQCCN |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
Maximum seat height |
1.1 mm |
1 mm |
2 mm |
1.75 mm |
1.1 mm |
1 mm |
Maximum supply voltage (Vsup) |
10 V |
5.5 V |
5.5 V |
10 V |
5.5 V |
10 V |
Minimum supply voltage (Vsup) |
2 V |
4.5 V |
4.5 V |
2 V |
4.5 V |
2 V |
Nominal supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
Maximum disconnect time |
45 ns |
53 ns |
53 ns |
45 ns |
53 ns |
45 ns |
Maximum connection time |
30 ns |
36 ns |
36 ns |
30 ns |
36 ns |
30 ns |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
Terminal pitch |
0.65 mm |
0.5 mm |
0.65 mm |
1.27 mm |
0.65 mm |
0.5 mm |
Terminal location |
DUAL |
QUAD |
DUAL |
DUAL |
DUAL |
QUAD |
Maximum time at peak reflow temperature |
30 |
30 |
30 |
30 |
30 |
30 |
width |
4.4 mm |
2.5 mm |
5.3 mm |
3.9 mm |
4.4 mm |
2.5 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |