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2170191-1

Description
SFP+ Enhanced 1x4 , W/ Low Heatsink
CategoryThe connector   
File Size856KB,17 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
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2170191-1 Overview

SFP+ Enhanced 1x4 , W/ Low Heatsink

2170191-1 Parametric

Parameter NameAttribute value
DimensionsSFP+
cage typeLinkage
Radiator includedyes
Connector Systemcable to board
Sealableno
Connectors and terminals terminate toA printed circuit board
Port matrix configuration1 x 4
Number of ports4
Data rate (max) (Gb/s)16
Radiator typePin
Radiator height categorycustom made
Radiator height3.3 mm [ .13 in ]
PCB Termination MethodsThrough hole - solderless connection
PCB installation methodThrough hole solderless connection
Connector mounting typeboard mounting
cage materialnickel silver
PCB thickness (recommended)2.25 mm [ .089 in ]
tail length2.05 mm [ .081 in ]
Working group temperature range-55 – 105 °C [ -67 – 221 °F ]
Suitable for pluggable I/O productsSFP+ SMT connector
Pluggable I/O ApplicationsSFP+ enhanced
Circuit ApplicationSignal
Compatible radiatorsyes
Encapsulation methodPallets, boxes and pallets
EMI containment feature typesexternal spring
Light pipe includedno
CommentRadiator without first row of pins

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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