Low Voltage 16-Bit D-Type Flip-Flop with Bushold
| 74LCXH16374_05 | 74LCXH16374 | 74LCXH16374G | 74LCXH16374MEA | 74LCXH16374MTD | |
|---|---|---|---|---|---|
| Description | Low Voltage 16-Bit D-Type Flip-Flop with Bushold | Low Voltage 16-Bit D-Type Flip-Flop with Bushold | Low Voltage 16-Bit D-Type Flip-Flop with Bushold | Low Voltage 16-Bit D-Type Flip-Flop with Bushold | Low Voltage 16-Bit D-Type Flip-Flop with Bushold |
| Is it lead-free? | - | - | Lead free | Lead free | Lead free |
| Is it Rohs certified? | - | - | incompatible | conform to | conform to |
| Parts packaging code | - | - | BGA | SSOP | TSSOP |
| package instruction | - | - | LFBGA, BGA54,6X9,32 | SSOP, SSOP48,.4 | TSSOP, TSSOP48,.3,20 |
| Contacts | - | - | 54 | 48 | 48 |
| Reach Compliance Code | - | - | compli | compli | compli |
| series | - | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 code | - | - | R-PBGA-B54 | R-PDSO-G48 | R-PDSO-G48 |
| JESD-609 code | - | - | e0 | e3 | e4 |
| length | - | - | 8 mm | 15.875 mm | 12.5 mm |
| Load capacitance (CL) | - | - | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | - | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Maximum Frequency@Nom-Su | - | - | 170000000 Hz | 170000000 Hz | 170000000 Hz |
| MaximumI(ol) | - | - | 0.024 A | 0.024 A | 0.024 A |
| Humidity sensitivity level | - | - | 3 | 1 | 2 |
| Number of digits | - | - | 8 | 8 | 8 |
| Number of functions | - | - | 2 | 2 | 2 |
| Number of ports | - | - | 2 | 2 | 2 |
| Number of terminals | - | - | 54 | 48 | 48 |
| Maximum operating temperature | - | - | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C |
| Output characteristics | - | - | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | - | - | TRUE | TRUE | TRUE |
| Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | LFBGA | SSOP | TSSOP |
| Encapsulate equivalent code | - | - | BGA54,6X9,32 | SSOP48,.4 | TSSOP48,.3,20 |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | - | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing | - | - | RAIL | RAIL | RAIL |
| Peak Reflow Temperature (Celsius) | - | - | 260 | 260 | 260 |
| power supply | - | - | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | - | - | 6.2 ns | 6.2 ns | 6.2 ns |
| propagation delay (tpd) | - | - | 7.4 ns | 7.4 ns | 7.4 ns |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 1.4 mm | 2.74 mm | 1.2 mm |
| Maximum supply voltage (Vsup) | - | - | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | - | - | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | - | - | 2.5 V | 2.5 V | 2.5 V |
| surface mount | - | - | YES | YES | YES |
| technology | - | - | CMOS | CMOS | CMOS |
| Temperature level | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | - | - | BALL | GULL WING | GULL WING |
| Terminal pitch | - | - | 0.8 mm | 0.635 mm | 0.5 mm |
| Terminal location | - | - | BOTTOM | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | - | NOT SPECIFIED | NOT SPECIFIED | 30 |
| Trigger type | - | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| width | - | - | 5.5 mm | 7.495 mm | 6.1 mm |
| Base Number Matches | - | - | 1 | 1 | 1 |
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