Low Voltage 16-Bit Buffer/Line Driver with Bushold
74LCXH16244 | 74LCXH16244G | 74LCXH16244MEA | 74LCXH16244_05 | 74LCXH16244MTD | |
---|---|---|---|---|---|
Description | Low Voltage 16-Bit Buffer/Line Driver with Bushold | Low Voltage 16-Bit Buffer/Line Driver with Bushold | Low Voltage 16-Bit Buffer/Line Driver with Bushold | Low Voltage 16-Bit Buffer/Line Driver with Bushold | Low Voltage 16-Bit Buffer/Line Driver with Bushold |
Is it lead-free? | - | Lead free | Lead free | - | Lead free |
Is it Rohs certified? | - | incompatible | conform to | - | conform to |
Parts packaging code | - | BGA | SSOP | - | TSSOP |
package instruction | - | LFBGA, BGA54,6X9,32 | SSOP, SSOP48,.4 | - | TSSOP, TSSOP48,.3,20 |
Contacts | - | 54 | 48 | - | 48 |
Reach Compliance Code | - | compli | compli | - | compli |
Control type | - | ENABLE LOW | ENABLE LOW | - | ENABLE LOW |
series | - | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z |
JESD-30 code | - | R-PBGA-B54 | R-PDSO-G48 | - | R-PDSO-G48 |
JESD-609 code | - | e0 | e3 | - | e4 |
length | - | 8 mm | 15.875 mm | - | 12.5 mm |
Load capacitance (CL) | - | 50 pF | 50 pF | - | 50 pF |
Logic integrated circuit type | - | BUS DRIVER | BUS DRIVER | - | BUS DRIVER |
MaximumI(ol) | - | 0.024 A | 0.024 A | - | 0.024 A |
Humidity sensitivity level | - | 3 | 1 | - | 2 |
Number of digits | - | 4 | 4 | - | 4 |
Number of functions | - | 4 | 4 | - | 4 |
Number of ports | - | 2 | 2 | - | 2 |
Number of terminals | - | 54 | 48 | - | 48 |
Maximum operating temperature | - | 85 °C | 85 °C | - | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C | - | -40 °C |
Output characteristics | - | 3-STATE | 3-STATE | - | 3-STATE |
Output polarity | - | TRUE | TRUE | - | TRUE |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
encapsulated code | - | LFBGA | SSOP | - | TSSOP |
Encapsulate equivalent code | - | BGA54,6X9,32 | SSOP48,.4 | - | TSSOP48,.3,20 |
Package shape | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
Package form | - | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing | - | TRAY | RAIL | - | RAIL |
Peak Reflow Temperature (Celsius) | - | 260 | 260 | - | 260 |
power supply | - | 3.3 V | 3.3 V | - | 3.3 V |
Prop。Delay @ Nom-Su | - | 4.5 ns | 4.5 ns | - | 4.5 ns |
propagation delay (tpd) | - | 5.4 ns | 5.4 ns | - | 5.4 ns |
Certification status | - | Not Qualified | Not Qualified | - | Not Qualified |
Maximum seat height | - | 1.4 mm | 2.74 mm | - | 1.2 mm |
Maximum supply voltage (Vsup) | - | 3.6 V | 3.6 V | - | 3.6 V |
Minimum supply voltage (Vsup) | - | 2 V | 2 V | - | 2 V |
Nominal supply voltage (Vsup) | - | 2.5 V | 2.5 V | - | 2.5 V |
surface mount | - | YES | YES | - | YES |
technology | - | CMOS | CMOS | - | CMOS |
Temperature level | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
Terminal surface | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form | - | BALL | GULL WING | - | GULL WING |
Terminal pitch | - | 0.8 mm | 0.635 mm | - | 0.5 mm |
Terminal location | - | BOTTOM | DUAL | - | DUAL |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | - | 30 |
width | - | 5.5 mm | 7.495 mm | - | 6.1 mm |
Base Number Matches | - | 1 | 1 | - | 1 |