Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Alliance Memory |
Parts packaging code | TSOP |
package instruction | TSOP1, TSSOP28,.53,22 |
Contacts | 28 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 20 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G28 |
length | 11.8 mm |
memory density | 262144 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 32KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP1 |
Encapsulate equivalent code | TSSOP28,.53,22 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.002 A |
Minimum standby current | 3 V |
Maximum slew rate | 0.035 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | GULL WING |
Terminal pitch | 0.55 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 8 mm |
Base Number Matches | 1 |
AS7C3256A-20TI | AS7C3256A-10JC | AS7C3256A-10JI | AS7C3256A-20TC | AS7C3256A-15TC | AS7C3256A-15TI | |
---|---|---|---|---|---|---|
Description | Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Alliance Memory | Alliance Memory | Alliance Memory | Alliance Memory | Alliance Memory | Alliance Memory |
Parts packaging code | TSOP | SOJ | SOJ | TSOP | TSOP | TSOP |
package instruction | TSOP1, TSSOP28,.53,22 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | TSOP1, TSSOP28,.53,22 | TSOP1, TSSOP28,.53,22 | TSOP1, TSSOP28,.53,22 |
Contacts | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 20 ns | 10 ns | 10 ns | 20 ns | 15 ns | 15 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
length | 11.8 mm | 18.415 mm | 18.415 mm | 11.8 mm | 11.8 mm | 11.8 mm |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSOP1 | SOJ | SOJ | TSOP1 | TSOP1 | TSOP1 |
Encapsulate equivalent code | TSSOP28,.53,22 | SOJ28,.34 | SOJ28,.34 | TSSOP28,.53,22 | TSSOP28,.53,22 | TSSOP28,.53,22 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 | 225 | 225 | 240 | 240 | 240 |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 3.7592 mm | 3.7592 mm | 1.2 mm | 1.2 mm | 1.2 mm |
Maximum standby current | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
Minimum standby current | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Maximum slew rate | 0.035 mA | 0.05 mA | 0.05 mA | 0.035 mA | 0.04 mA | 0.04 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
Terminal form | GULL WING | J BEND | J BEND | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.55 mm | 1.27 mm | 1.27 mm | 0.55 mm | 0.55 mm | 0.55 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 |
width | 8 mm | 7.62 mm | 7.62 mm | 8 mm | 8 mm | 8 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |