DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184
Parameter Name | Attribute value |
Maker | SAMSUNG |
Parts packaging code | DIMM |
package instruction | , |
Contacts | 184 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 0.75 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N184 |
memory density | 2147483648 bit |
Memory IC Type | DDR DRAM MODULE |
memory width | 64 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 184 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32MX64 |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified |
self refresh | YES |
Maximum supply voltage (Vsup) | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | DUAL |
Base Number Matches | 1 |
KMM368L3313BT-FZ | KMM368L3313BT-GY | KMM368L3313BT-G0 | KMM368L3313BT-GF0 | KMM368L3313BT-GZ | KMM368L3313BT-GFY | KMM368L3313BT-GFZ | KMM368L3313BT-F0 | KMM368L3313BT-FY | |
---|---|---|---|---|---|---|---|---|---|
Description | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | DDR DRAM Module, 32MX64, 0.8ns, CMOS, DIMM-184 | DRAM | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | DRAM | DRAM | DDR DRAM Module, 32MX64, 0.8ns, CMOS, DIMM-184 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 |
Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Parts packaging code | DIMM | DIMM | DIMM | - | DIMM | - | - | DIMM | DIMM |
Contacts | 184 | 184 | 184 | - | 184 | - | - | 184 | 184 |
ECCN code | EAR99 | EAR99 | EAR99 | - | EAR99 | - | - | EAR99 | EAR99 |
access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | - | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Maximum access time | 0.75 ns | 0.75 ns | 0.8 ns | - | 0.75 ns | - | - | 0.8 ns | 0.75 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | - | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | - | R-XDMA-N184 | - | - | R-XDMA-N184 | R-XDMA-N184 |
memory density | 2147483648 bit | 2147483648 bit | 2147483648 bit | - | 2147483648 bit | - | - | 2147483648 bit | 2147483648 bit |
Memory IC Type | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | - | DDR DRAM MODULE | - | - | DDR DRAM MODULE | DDR DRAM MODULE |
memory width | 64 | 64 | 64 | - | 64 | - | - | 64 | 64 |
Number of functions | 1 | 1 | 1 | - | 1 | - | - | 1 | 1 |
Number of ports | 1 | 1 | 1 | - | 1 | - | - | 1 | 1 |
Number of terminals | 184 | 184 | 184 | - | 184 | - | - | 184 | 184 |
word count | 33554432 words | 33554432 words | 33554432 words | - | 33554432 words | - | - | 33554432 words | 33554432 words |
character code | 32000000 | 32000000 | 32000000 | - | 32000000 | - | - | 32000000 | 32000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | - | 70 °C | - | - | 70 °C | 70 °C |
organize | 32MX64 | 32MX64 | 32MX64 | - | 32MX64 | - | - | 32MX64 | 32MX64 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | - | - | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | - | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified |
self refresh | YES | YES | YES | - | YES | - | - | YES | YES |
Maximum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | - | - | 2.7 V | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V | 2.3 V | 2.3 V | - | 2.3 V | - | - | 2.3 V | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V | - | - | 2.5 V | 2.5 V |
surface mount | NO | NO | NO | - | NO | - | - | NO | NO |
technology | CMOS | CMOS | CMOS | - | CMOS | - | - | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | - | - | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL | DUAL | - | DUAL | - | - | DUAL | DUAL |