|
KMM5322204C2W-5 |
KMM5322204C2W-6 |
Description |
EDO DRAM Module, 2MX32, 50ns, CMOS, DIMM-72 |
EDO DRAM Module, 2MX32, 60ns, CMOS, DIMM-72 |
Maker |
SAMSUNG |
SAMSUNG |
Parts packaging code |
DIMM |
DIMM |
package instruction |
SIMM, SSIM72 |
SIMM, SSIM72 |
Contacts |
72 |
72 |
Reach Compliance Code |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
access mode |
FAST PAGE WITH EDO |
FAST PAGE WITH EDO |
Maximum access time |
50 ns |
60 ns |
Other features |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O type |
COMMON |
COMMON |
JESD-30 code |
R-XDMA-N72 |
R-XDMA-N72 |
memory density |
67108864 bit |
67108864 bit |
Memory IC Type |
EDO DRAM MODULE |
EDO DRAM MODULE |
memory width |
32 |
32 |
Number of functions |
1 |
1 |
Number of ports |
1 |
1 |
Number of terminals |
72 |
72 |
word count |
2097152 words |
2097152 words |
character code |
2000000 |
2000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
organize |
2MX32 |
2MX32 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
SIMM |
SIMM |
Encapsulate equivalent code |
SSIM72 |
SSIM72 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
power supply |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
refresh cycle |
1024 |
1024 |
Maximum seat height |
19.05 mm |
19.05 mm |
self refresh |
NO |
NO |
Maximum standby current |
0.004 A |
0.004 A |
Maximum slew rate |
0.304 mA |
0.284 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
NO |
NO |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal form |
NO LEAD |
NO LEAD |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
Base Number Matches |
1 |
1 |