SIM3L136-C-GQ datasheet, PDF - EEWORLD Datasheet

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SIM3L136-C-GQ: DescriptionRISC Microcontroller, 32-Bit, FLASH, CORTEX-M3 CPU, 50MHz, CMOS, PQFP64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，91 Pages; ManufacturerSilicon Laboratories Inc; Environmental Compliance

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SIM3L136-C-GQ Overview

RISC Microcontroller, 32-Bit, FLASH, CORTEX-M3 CPU, 50MHz, CMOS, PQFP64

SIM3L136-C-GQ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Silicon Laboratories Inc
Reach Compliance Code	compliant
Has ADC	YES
Address bus width
bit size	32
CPU series	CORTEX-M3
maximum clock frequency	25 MHz
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G64
length	10 mm
Number of I/O lines	51
Number of terminals	64
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Encapsulate equivalent code	TQFP64,.47SQ
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
power supply	2/3.3 V
Certification status	Not Qualified
RAM (bytes)	8192
rom(word)	32768
ROM programmability	FLASH
speed	50 MHz
Maximum supply voltage	3.8 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

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SiM3L1xx

High-Performance, Low-Power, 32-Bit Precision32™

MCU Family with up to 256 kB of Flash

32-bit ARM Cortex-M3 CPU

50 MHz maximum frequency

Single-cycle multiplication, hardware division support

Nested vectored interrupt control (NVIC) with 8 priority levels

Memory

32–256 kB flash, in-system programmable

8–32 kB SRAM with configurable low power retention

Clock Sources

Internal oscillator with PLL: 23–50 MHz

Low power internal oscillator: 20 MHz

Low frequency internal oscillator (LFO): 16.4 kHz

External real-time clock (RTC) crystal oscillator

External oscillator: Crystal, RC, C, CMOS clock

Power Management

Three adjustable low drop-out (LDO) regulators

Power-on reset circuit and brownout detectors

DC-DC buck converter allows dynamic voltage scaling for

maximum efficiency (250 mW output)

Multiple power modes supported for low power optimization

Analog Peripherals

12-Bit Analog-to-Digital Converter: Up to 250 ksps 12-bit mode

2 x Low-current comparators

or 1 Msps 10-bit mode

10-Bit Current-mode Digital-to-Analog Converter

Digital and Communication Peripherals

1 x USART with IrDA and ISO7816 Smartcard support

1 x UART that operates in low power mode

2 x SPIs, 1 x I2C, 16/32-bit CRC

128/192/256-bit Hardware AES Encryption

Encoder/Decoder: Manchester and Three-out-of-Six

Integrated LCD Controller: up to 160 segments (40x4), auto-

contrast and low power operation

Timers/Counters

3 x 32-bit or 6 x 16-bit timers with capture/compare

16-bit, 6-channel counter with capture/compare/PWM and

dead-time controller with differential outputs

16-bit low power timer/advanced capture counter operational in

the lowest power mode

32-bit real time clock (RTC) with multiple alarms

Low Power Features

75 nA typical current in Power Mode 8

Low-current RTC (180 nA from LFO, 300 nA from crystal)

4 µs wakeup, register state retention and no reset required from

140 µA/MHz at 3.6 V executing from SRAM

Specialized on-chip charge pump reduces power consumption

Process/Voltage/Temperature (PVT) Monitor

5 V Tolerant Flexible I/O

Up to 62 contiguous 5 V tolerant GPIO with one priority cross-

bar providing flexibility in pin assignments

lowest power mode

175 µA/MHz at 3.6 V executing from flash

Watchdog timer

Low power mode advanced capture counter (ACCTR)

Data Transfer Peripherals

10-Channel DMA Controller

3 Channel Data Transfer Manager manages complex DMA

transfers without core intervention

On-Chip Debugging

Serial wire debug (SWD) with serial wire viewer (SWV) or JTAG

(no boundary scan) allow debug and programming

Cortex-M3 embedded trace macrocell (ETM)

Temperature Range: –40 to +85 °C

Supply Voltage: 1.8 to 3.8 V

Power

Scalable Digital LDO

Scalable Memory LDO

Scalable Analog LDO

DC-DC Buck Converter

Low Power Mode Charge Pump

Power Management Unit

32/64/128/256 kB Flash

Package Options

QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)

TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm)

Core / Memory / Support

ARM Cortex M3 (50 MHz)

8/16/32 kB Retention

RAM

Analog Peripherals

SAR ADC

(12-bit 250 ksps / 10-bit 1 Msps)

Voltage Reference

Current-Source DAC

2 x Low Current Comparators

Advanced Capture Counter

Flexible Pin Muxing

10-Ch DMA Controller + 3x Data Transfer Mgr.

Watchdog

Supply Monitor

Serial Wire or JTAG Debug / Programming + ETM

Clocking / Oscillators

50 MHz PLL

Real-Time Clock w/ Dedicated Crystal Oscillator

16 kHz Low Frequency Oscillator

20 MHz Low Power Oscillator

External Clock (XTAL / RC / C / CMOS)

Clock Selection

and Gating

1 x I2C

Digital Peripherals

2 x SPI

AES

CRC

Priority Crossbar

Encoder

3 x 32-bit Timers (6 x 16-bit)

1 x UART, 1 x USART w/ IrDA/SmartCard

Encoder/Decoder

6-Channel PWM

Low-Power Timer

LCD Controller

Rev 1.1 11/14

62 Multi-Function 5V-Tolerant I/O Pins

SiM3L1xx

SiM3L1xx

Ta b l e o f C o n t e n ts

1. Related Documents and Conventions ...............................................................................5

1.1. Related Documents........................................................................................................5

1.1.1. SiM3L1xx Reference Manual.................................................................................5

1.1.2. Hardware Access Layer (HAL) API Description ....................................................5

1.1.3. ARM Cortex-M3 Reference Manual.......................................................................5

1.2. Conventions ...................................................................................................................5

2. Typical Connection Diagrams ............................................................................................6

2.1. Power .............................................................................................................................6

3. Electrical Specifications......................................................................................................8

3.1. Electrical Characteristics ................................................................................................8

3.2. Thermal Conditions ...................................................................................................... 30

3.3. Absolute Maximum Ratings..........................................................................................31

4. Precision32™ SiM3L1xx System Overview.....................................................................32

4.1. Power ........................................................................................................................... 34

4.1.1. DC-DC Buck Converter (DCDC0)........................................................................ 34

4.1.2. Three Low Dropout LDO Regulators (LDO0) ...................................................... 35

4.1.3. Voltage Supply Monitor (VMON0) ....................................................................... 35

4.1.4. Power Management Unit (PMU).......................................................................... 35

4.1.5. Device Power Modes........................................................................................... 35

4.1.6. Process/Voltage/Temperature Monitor (TIMER2 and PVTOSC0)....................... 38

4.2. I/O................................................................................................................................. 39

4.2.1. General Features.................................................................................................39

4.2.2. Crossbar .............................................................................................................. 39

4.3. Clocking........................................................................................................................ 40

4.3.1. PLL (PLL0)........................................................................................................... 41

4.3.2. Low Power Oscillator (LPOSC0) ......................................................................... 41

4.3.3. Low Frequency Oscillator (LFOSC0)................................................................... 41

4.3.4. External Oscillators (EXTOSC0).......................................................................... 41

4.4. Integrated LCD Controller (LCD0)................................................................................ 42

4.5. Data Peripherals...........................................................................................................43

4.5.1. 10-Channel DMA Controller................................................................................. 43

4.5.2. Data Transfer Managers (DTM0, DTM1, DTM2) ................................................. 43

4.5.3. 128/192/256-bit Hardware AES Encryption (AES0) ............................................ 43

4.5.4. 16/32-bit Enhanced CRC (ECRC0) .....................................................................44

4.5.5. Encoder / Decoder (ENCDEC0) .......................................................................... 44

4.6. Counters/Timers........................................................................................................... 45

4.6.1. 32-bit Timer (TIMER0, TIMER1, TIMER2)........................................................... 45

4.6.2. Enhanced Programmable Counter Array (EPCA0) ............................................. 45

4.6.3. Real-Time Clock (RTC0) ..................................................................................... 46

4.6.4. Low Power Timer (LPTIMER0)............................................................................46

4.6.5. Watchdog Timer (WDTIMER0)............................................................................46

4.6.6. Low Power Mode Advanced Capture Counter (ACCTR0)................................... 47

4.7. Communications Peripherals ....................................................................................... 48

4.7.1. USART (USART0) ............................................................................................... 48

Rev 1.1

SiM3L1xx

4.7.2. UART (UART0).................................................................................................... 48

4.7.3. SPI (SPI0, SPI1) .................................................................................................. 49

4.7.4. I2C (I2C0) ............................................................................................................ 49

4.8. Analog .......................................................................................................................... 50

4.8.1. 12-Bit Analog-to-Digital Converter (SARADC0)................................................... 50

4.8.2. 10-Bit Digital-to-Analog Converter (IDAC0) ......................................................... 50

4.8.3. Low Current Comparators (CMP0, CMP1) .......................................................... 50

4.9. Reset Sources..............................................................................................................51

4.10.Security ........................................................................................................................ 52

4.11.On-Chip Debugging ..................................................................................................... 52

5. Ordering Information .........................................................................................................53

6. Pin Definitions.................................................................................................................... 55

6.1. SiM3L1x7 Pin Definitions ............................................................................................. 55

6.2. SiM3L1x6 Pin Definitions ............................................................................................. 62

6.3. SiM3L1x4 Pin Definitions ............................................................................................. 69

6.4. TQFP-80 Package Specifications ................................................................................ 74

6.4.1. TQFP-80 Solder Mask Design............................................................................. 77

6.4.2. TQFP-80 Stencil Design ...................................................................................... 77

6.4.3. TQFP-80 Card Assembly..................................................................................... 77

6.5. QFN-64 Package Specifications .................................................................................. 78

6.5.1. QFN-64 Solder Mask Design............................................................................... 80

6.5.2. QFN-64 Stencil Design ........................................................................................ 80

6.5.3. QFN-64 Card Assembly....................................................................................... 80

6.6. TQFP-64 Package Specifications ................................................................................ 81

6.6.1. TQFP-64 Solder Mask Design............................................................................. 84

6.6.2. TQFP-64 Stencil Design ...................................................................................... 84

6.6.3. TQFP-64 Card Assembly..................................................................................... 84

6.7. QFN-40 Package Specifications .................................................................................. 85

6.7.1. QFN-40 Solder Mask Design............................................................................... 87

6.7.2. QFN-40 Stencil Design ........................................................................................ 87

6.7.3. QFN-40 Card Assembly....................................................................................... 87

7. Revision Specific Behavior............................................................................................... 88

7.1. Revision Identification .................................................................................................. 88

Document Change List ........................................................................................................... 90

Contact Information ................................................................................................................ 91

Rev 1.1

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