3592-033-511 datasheet, PDF - EEWORLD Datasheet

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3592-033-511: DescriptionCard Edge Connector, 168 Contact(s), 2 Row(s), Straight, 0.05 inch Pitch, Solder Terminal, Latch & Eject, Black Insulator, Receptacle; CategoryThe connector The connector; File Size271KB，1 Pages; ManufacturerTekcon Electronics Corp

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3592-033-511 Overview

Card Edge Connector, 168 Contact(s), 2 Row(s), Straight, 0.05 inch Pitch, Solder Terminal, Latch & Eject, Black Insulator, Receptacle

3592-033-511 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Tekcon Electronics Corp
Reach Compliance Code	unknown
Other features	3.3V MODULE, W/RIGHT KEY
Board mount options	SPLIT BOARD LOCK
body width	0.297 inch
subject depth	0.591 inch
body length	5.55 inch
Body/casing type	RECEPTACLE
Connector type	CARD EDGE CONNECTOR
Contact to complete cooperation	AU
Contact completed and terminated	Tin/Lead (Sn/Pb)
Contact material	COPPER ALLOY
Contact resistance	30 mΩ
Contact style	BELLOWED TYPE
Dielectric withstand voltage	1000VAC V
Durability	25 Cycles
maximum insertion force	1.39 N
Insulation resistance	10000000000 Ω
Insulator color	BLACK
insulator material	LIQUID CRYSTAL POLYMER (LCP)
JESD-609 code	e0
Manufacturer's serial number	3592
Plug contact pitch	0.05 inch
Installation option 1	LATCH & EJECT
Installation option 2	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	4
Number of rows loaded	2
Maximum operating temperature	105 °C
Minimum operating temperature	-55 °C
PCB contact pattern	STAGGERED
PCB contact row spacing	0.075 mm
Plating thickness	FLASH inch
polarization key	POLARIZED HOUSING
Rated current (signal)	1 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	2.54 mm
Termination type	SOLDER
Total number of contacts	168
Base Number Matches	1

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http://www.tekcon.com

http://www.tekcon.com.tw

3592 Series

DIMM Socket

1.27 mm Pitch, Forming Type

Ordering Information

3592

X X X

XX X

Contact Plating

A - Gold Flash all area

0 - Gold Flash/Tin

1 - 10

µ"

Gold/Tin

2 - 20

µ"

Gold/Tin

3 - 30

µ"

Gold/Tin

4 - 3

µ"

Gold/Tin

5 - 15

µ"

Gold/Tin

8 - Tin

Voltage Key

3 - apply 3.3 V module

5 - apply 5 V module

Function Key (DRAM Key)

1-offset Left Key. (SDRAM)

2-offset Centered Key(DRAM)

3-offset Right Key (Unbuffered DRAM)

Housing Material

1 - LCP, Black

2 - LCP, Ivory

5 - Ny66, Black

6 - Ny66, Ivory

7 - PBT, Black

8 - PBT, Ivory

With Post Position

51- with A,B,C Metal Clip

52- with B,C,D Metal Clip

Specification

Materials:

Housing & Latch:

High Temperature Glass Fiber Reinforced

Thermoplastic, UL94V-0.

Contact:

Copper Alloy.

Plating:

Gold Flash on Contact Area and Tin/

Lead on Solder Tail.

Electrical:

Insulation Resistance:

10,000 MΩ Minimum.

Dielectric Withstanding Voltage:

1000 VAC R.M.S.

Voltage Rating:

500V.

Current Rating:

1 AMP.

Contact Resistance:

30 mΩ Maximum.

Capacitance:

1 PF (Max.) at 1Mhz between

randomly selected adjacent contacts.

Mechanical

Durability:

25 cycles Minimum.

Contact Engaging Force:

1.390N Maximum,

Pair Contact.

Contact Retention Force:

500 g Minimum,

per Contact.

Accept Standard JEDEC Modules:

0.05 +/- 0.004

Enviromental

Temperature: -558C to +1058C

Dimensions

TEKCON Electronics Corporation

11-1

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