BAS221/T3 datasheet, PDF - EEWORLD Datasheet

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BAS221/T3: DescriptionDIODE 0.3 A, 250 V, SILICON, SIGNAL DIODE, CERAMIC PACKAGE-2, Signal Diode; CategoryDiscrete semiconductor diode; File Size57KB，8 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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BAS221/T3 Overview

DIODE 0.3 A, 250 V, SILICON, SIGNAL DIODE, CERAMIC PACKAGE-2, Signal Diode

BAS221/T3 Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	R-CDSO-C2
Contacts	2
Reach Compliance Code	unknown
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
JESD-30 code	R-CDSO-C2
Number of components	1
Number of terminals	2
Maximum output current	0.3 A
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Maximum power dissipation	0.4 W
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	250 V
Maximum reverse recovery time	0.05 µs
surface mount	YES
Terminal form	C BEND
Terminal location	DUAL
Base Number Matches	1

BAS221/T3 Related Products

	BAS221/T3	BAS221T/R	934047310135	934047310115	BAS221
Description	DIODE 0.3 A, 250 V, SILICON, SIGNAL DIODE, CERAMIC PACKAGE-2, Signal Diode	DIODE 0.3 A, 250 V, SILICON, SIGNAL DIODE, CERAMIC PACKAGE-2, Signal Diode	DIODE 0.3 A, 250 V, SILICON, SIGNAL DIODE, CERAMIC, SMD, 2 PIN, Signal Diode	DIODE 0.3 A, 250 V, SILICON, SIGNAL DIODE, CERAMIC, SMD, 2 PIN, Signal Diode	DIODE 0.3 A, 250 V, SILICON, SIGNAL DIODE, CERAMIC PACKAGE-2, Signal Diode
package instruction	R-CDSO-C2	R-CDSO-C2	R-CDSO-C2	R-CDSO-C2	R-CDSO-C2
Contacts	2	2	2	2	2
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Configuration	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Diode component materials	SILICON	SILICON	SILICON	SILICON	SILICON
Diode type	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE
JESD-30 code	R-CDSO-C2	R-CDSO-C2	R-CDSO-C2	R-CDSO-C2	R-CDSO-C2
Number of components	1	1	1	1	1
Number of terminals	2	2	2	2	2
Maximum output current	0.3 A	0.3 A	0.3 A	0.3 A	0.3 A
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Maximum power dissipation	0.4 W	0.4 W	0.4 W	0.4 W	0.4 W
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum repetitive peak reverse voltage	250 V	250 V	250 V	250 V	250 V
Maximum reverse recovery time	0.05 µs	0.05 µs	0.05 µs	0.05 µs	0.05 µs
surface mount	YES	YES	YES	YES	YES
Terminal form	C BEND	C BEND	C BEND	C BEND	C BEND
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	NXP	-	NXP	NXP	NXP

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