|
AT24C32N-10SC |
AT24C64W-10SC-27 |
AT24C64N-10SC-2.7 |
AT24C64W-10SI-2.7 |
AT24C32N-10SC-2.7 |
Description |
EEPROM |
EEPROM 64K (8Kx8) 2.7V |
Electrically erasable programmable read-only memory SO-8 64K (8KX8) 2.7V |
Electrically Erasable Programmable Read Only Memory 32/64k 2-Wire Bus |
electrically erasable programmable read-only memory |
Is it Rohs certified? |
incompatible |
- |
incompatible |
incompatible |
incompatible |
Maker |
Atmel (Microchip) |
- |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Parts packaging code |
SOIC |
- |
SOIC |
SOIC |
SOIC |
package instruction |
SOP, SOP8,.25 |
- |
SOP, SOP8,.25 |
SOP, SOP8,.3 |
SOP, SOP8,.25 |
Contacts |
8 |
- |
8 |
8 |
8 |
Reach Compliance Code |
unknown |
- |
compliant |
compliant |
unknown |
ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
Other features |
DATA RETENTION: 100 YEARS |
- |
DATA RETENTION: 100 YEARS |
DATA RETENTION: 100 YEARS |
DATA RETENTION: 100 YEARS |
Maximum clock frequency (fCLK) |
0.4 MHz |
- |
0.1 MHz |
0.1 MHz |
0.1 MHz |
Data retention time - minimum |
100 |
- |
100 |
100 |
100 |
Durability |
1000000 Write/Erase Cycles |
- |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
I2C control byte |
1010DDDR |
- |
1010DDDR |
1010DDDR |
1010DDDR |
JESD-30 code |
R-PDSO-G8 |
- |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
e0 |
- |
e0 |
e0 |
e0 |
length |
4.89 mm |
- |
4.89 mm |
5.31 mm |
4.89 mm |
memory density |
32768 bit |
- |
65536 bit |
65536 bit |
32768 bit |
Memory IC Type |
EEPROM |
- |
EEPROM |
EEPROM |
EEPROM |
memory width |
8 |
- |
8 |
8 |
8 |
Number of functions |
1 |
- |
1 |
1 |
1 |
Number of terminals |
8 |
- |
8 |
8 |
8 |
word count |
4096 words |
- |
8192 words |
8192 words |
4096 words |
character code |
4000 |
- |
8000 |
8000 |
4000 |
Operating mode |
SYNCHRONOUS |
- |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
70 °C |
- |
70 °C |
85 °C |
70 °C |
organize |
4KX8 |
- |
8KX8 |
8KX8 |
4KX8 |
Output characteristics |
OPEN-DRAIN |
- |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
- |
SOP |
SOP |
SOP |
Encapsulate equivalent code |
SOP8,.25 |
- |
SOP8,.25 |
SOP8,.3 |
SOP8,.25 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
- |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
Parallel/Serial |
SERIAL |
- |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
240 |
- |
240 |
240 |
240 |
power supply |
5 V |
- |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.73 mm |
- |
1.73 mm |
2.03 mm |
1.73 mm |
Serial bus type |
I2C |
- |
I2C |
I2C |
I2C |
Maximum standby current |
0.000035 A |
- |
5e-7 A |
5e-7 A |
5e-7 A |
Maximum slew rate |
0.003 mA |
- |
0.003 mA |
0.003 mA |
0.003 mA |
Maximum supply voltage (Vsup) |
5.5 V |
- |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
- |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
5 V |
- |
3 V |
3 V |
3 V |
surface mount |
YES |
- |
YES |
YES |
YES |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
- |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
- |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
- |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
- |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
- |
30 |
30 |
30 |
width |
3.9 mm |
- |
3.9 mm |
5.27 mm |
3.9 mm |
Maximum write cycle time (tWC) |
10 ms |
- |
10 ms |
10 ms |
10 ms |
write protect |
HARDWARE |
- |
HARDWARE |
HARDWARE |
HARDWARE |