FPGA - Field Programmable Gate Array Axcelerator (AX)
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | LBGA, BGA256,16X16,40 |
Reach Compliance Code | compliant |
Other features | 250000 SYSTEM GATES AVAILABLE |
maximum clock frequency | 870 MHz |
Combined latency of CLB-Max | 0.74 ns |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e0 |
length | 17 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 2816 |
Equivalent number of gates | 250000 |
Number of entries | 248 |
Number of logical units | 4224 |
Output times | 248 |
Number of terminals | 256 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2816 CLBS, 250000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 1.5,1.5/3.3,2.5/3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 1.7 mm |
Maximum supply voltage | 1.575 V |
Minimum supply voltage | 1.425 V |
Nominal supply voltage | 1.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD/TIN LEAD SILVER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 17 mm |
Base Number Matches | 1 |