MCF53281CVM240 datasheet, PDF - EEWORLD Datasheet

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MCF53281CVM240: DescriptionMicroprocessors - MPU MCF5329 DRAGONFIRE; CategoryThe embedded processor and controller Microcontrollers and processors; File Size770KB，50 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MCF53281CVM240 Overview

Microprocessors - MPU MCF5329 DRAGONFIRE

MCF53281CVM240 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	BGA
package instruction	LBGA, BGA256,16X16,40
Contacts	256
Reach Compliance Code	unknown
ECCN code	5A992
Address bus width	24
bit size	32
boundary scan	YES
maximum clock frequency	80 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B256
length	17 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	256
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	1.5,1.8/3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
speed	240 MHz
Maximum supply voltage	1.6 V
Minimum supply voltage	1.4 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper - with Nickel barrier
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	17 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

MCF53281CVM240 Related Products

	MCF53281CVM240	MCF5327CVM240	MCF5329CVM240
Description	Microprocessors - MPU MCF5329 DRAGONFIRE	Microprocessors - MPU MCF5329 V2-CORE	Microprocessors - MPU MCF5329 V4CORE
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
Maker	NXP	NXP	NXP
Parts packaging code	BGA	BGA	BGA
package instruction	LBGA, BGA256,16X16,40	15 X 15 MM, ROHS COMPLIANT, MAPBGA-196	LBGA, BGA256,16X16,40
Contacts	256	196	256
Reach Compliance Code	unknown	unknown	unknown
ECCN code	5A992	5A992	5A002
Address bus width	24	24	24
bit size	32	32	32
boundary scan	YES	YES	YES
maximum clock frequency	80 MHz	80 MHz	80 MHz
External data bus width	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES
JESD-30 code	S-PBGA-B256	S-PBGA-B196	S-PBGA-B256
length	17 mm	15 mm	17 mm
low power mode	YES	YES	YES
Humidity sensitivity level	3	3	3
Number of terminals	256	196	256
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	BGA	LBGA
Encapsulate equivalent code	BGA256,16X16,40	BGA196,14X14,40	BGA256,16X16,40
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)	260	260	260
power supply	1.5,1.8/3.3 V	1.5,1.8/3.3 V	1.5,1.8/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.75 mm	1.6 mm
speed	240 MHz	240 MHz	240 MHz
Maximum supply voltage	1.6 V	1.6 V	1.6 V
Minimum supply voltage	1.4 V	1.4 V	1.4 V
Nominal supply voltage	1.5 V	1.5 V	1.5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper - with Nickel barrier	Tin/Silver/Copper - with Nickel barrier	Tin/Silver/Copper - with Nickel barrier
Terminal form	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40
width	17 mm	15 mm	17 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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