MSMBG2K3.0 – MSMBG2K5.0,
MSMBJ2K3.0 – MSMBJ2K5.0
Available
2 kW Surface Mount
Transient Voltage Suppressor
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
The MSMBG(J)2K3.0 – MSMBG(J)2K5.0 series of surface mount 2.0 kilowatt transient voltage
suppressors provide a selection of standoff voltages (V
WM
) from 3.0 to 5.0 volts. These high-
reliability controlled devices feature unidirectional construction. The SMBG Gull-wing design
in the DO-215AA package is ideal for visible solder connections. The SMBJ J-bend design in
the DO-214AA package is ideal for greater PC board mounting density. It is also available as
RoHS compliant.
DO-215AA
(SMBG) Package
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
•
•
•
•
High reliability upscreened devices with wafer fabrication and assembly lot traceability.
All devices 100% surge tested.
Suppresses transients up to 2 kW @ 8/20 µs.
Other screening in reference to MIL-PRF-19500 is also available. Refer to
MicroNote 129
for more
details on the screening options.
(See
part nomenclature
for all options.)
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B.
3σ lot norm screening performed on standby current I
D
.
RoHS compliant versions available.
•
•
•
DO-214AA
(SMBJ) Package
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
APPLICATIONS / BENEFITS
•
•
•
•
•
Voltage and reverse standby (leakage) current lowest available.
Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc.
Protection from switching transients & induced RF.
Compliant to IEC61000-4-2 and IEC61000-4-4 for ESD and EFT protection respectively.
Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance for class 1.
MAXIMUM RATINGS
@ 25 ºC unless otherwise stated
Parameters/Test Conditions
Junction and Storage Temperature
Peak Pulse Power Dissipation
Off-State Power Dissipation
T
clamping
(0 volts to V
(
BR)
min)
Forward Voltage @ 30 A
(3)
(1)
Symbol
T
J
and
T
STG
8/20 us
10/1000us
@ T
L
< 25 ºC
@ T
A
= 25 ºC
P
PP
P
D
Value
-65 to +150
2000
300
5
(2)
1.38
<100
1.2
260
Unit
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
W
W
ps
V
o
V
F
T
SP
Solder Temperature @ 10 s
C
Notes:
1. With impulse repetition rate (duty factor) of 0.01 maximum (also
Figure 1 and 4).
2. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see
last page).
3. Peak impulse of 8.3 ms half-sine wave.
RF01019, Rev. B (2/11/13)
©2013 Microsemi Corporation
Page 1 of 6
MSMBG2K3.0 – MSMBG2K5.0,
MSMBJ2K3.0 – MSMBJ2K5.0
MECHANICAL and PACKAGING
•
•
•
•
•
•
•
CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements.
TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL- STD-750, method 2026.
MARKING: Part number.
POLARITY: Cathode end banded.
TAPE & REEL option: Standard per EIA-296 (add “TR” suffix to part number). Consult factory for quantities.
WEIGHT: 0.1 grams (approximate).
See
package dimensions
on last page.
PART NOMENCLATURE
M
Reliability Level*
M
MA
MX
MXL
*(see
MicroNote 129)
Surface Mount Package
SM
B
G
2K 3.0
(e3)
RoHS Compliance
e3 = RoHS Compliant
Blank = non-RoHS Compliant
Stand-Off Voltage (V
WM
)
(see
Electrical Characteristics
table)
2 kW Transient Suppression
Package Size
Lead Form
G = Gull-Wing
J = J-Bend
Symbol
V
W M
P
PP
V
(
BR)
I
D
I
PP
V
C
SYMBOLS & DEFINITIONS
Definition
Working Peak (Standoff) Voltage - The maximum peak voltage that can be applied over the operating temperature
range. This is also referred to as standoff voltage.
Peak Pulse Power - Rated random recurring peak impulse power dissipation.
Breakdown Voltage - The minimum voltage the device will exhibit at a specified current.
Standby Current - The current at the rated standoff voltage (V
WM
).
Peak Pulse Current - The peak current during the impulse.
Clamping Voltage - Clamping voltage at I
PP
(Peak Pulse Current) at the specified pulse conditions (typically shown
as maximum value).
Breakdown Current – The current used for measuring breakdown voltage V
(
BR)
.
I
( BR)
ELECTRICAL CHARACTERISTICS
@ 25 ºC
BREAKDOWN
VOLTAGE
Minimum
BREAKDOWN
CURRENT
RATED
STANDOFF
VOLTAGE
MAX
STANDBY
CURRENT
MAX
CLAMPING
VOLTAGE
PEAK
PULSE
CURRENT
TEMPERATURE
COEFFICIANT
of V
(BR)
PART NUMBER
V
(
BR)
Gull-Wing
MSMBG2K3.0
MSMBG2K3.3
MSMBG2K4.0
MSMBG2K4.5
MSMBG2K5.0
J-Bend
MSMBJ2K3.0
MSMBJ2K3.3
MSMBJ2K4.0
MSMBJ2K4.5
MSMBJ2K5.0
V
4.3
4.6
5.0
5.4
5.9
I
(BR)
mA
50
50
50
50
50
V
WM
V
3.0
3.3
4.0
4.5
5.0
I
D
@ V
WM
µA
1500
700
400
50
5
V
C
@ I
PP
V
5.4
5.8
6.3
6.6
7.6
I
PP
A
10
10
10
10
10
α
V(BR)
% /
o
C
+0/ -0.05
±0.025
±0.030
±0.040
+0.050
RF01019, Rev. B (2/11/13)
©2013 Microsemi Corporation
Page 2 of 6
MSMBG2K3.0 – MSMBG2K5.0,
MSMBJ2K3.0 – MSMBJ2K5.0
GRAPHS
(continued)
Pulse Current in Percent of I
PP
t – Time – ms
Test waveform parameters: tr=10 µs, tp=1000µs
FIGURE 3
Pulse Waveform for 10/1000 Exponential Surge
Peak Pulse Power (P
PP
)
or continuous
Power in Percent of 25°C Ratio
T
L
Lead Temperature °C
FIGURE 4
Derating Curve
RF01019, Rev. B (2/11/13)
©2013 Microsemi Corporation
Page 4 of 6
Microcontroller MCU
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