Half Bridge IGBT Module
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Dynex |
| Parts packaging code | MODULE |
| package instruction | FLANGE MOUNT, R-XUFM-X7 |
| Contacts | 7 |
| Reach Compliance Code | unknow |
| Other features | LOW CONDUCTION LOSS |
| Shell connection | ISOLATED |
| Maximum collector current (IC) | 200 A |
| Collector-emitter maximum voltage | 1200 V |
| Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE |
| JESD-30 code | R-XUFM-X7 |
| Number of components | 2 |
| Number of terminals | 7 |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal form | UNSPECIFIED |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | POWER CONTROL |
| Transistor component materials | SILICON |
| Nominal off time (toff) | 850 ns |
| Nominal on time (ton) | 300 ns |
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