EDI2DL32256V35BC datasheet, PDF

EDI2DL32256V35BC: Description256Kx32 Synchronous Pipline Burst SRAM 3.3V; Categorystorage storage; File Size90KB，8 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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EDI2DL32256V35BC Overview

256Kx32 Synchronous Pipline Burst SRAM 3.3V

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	White Electronic Designs Corporation
package instruction	BGA, BGA119,7X17,50
Reach Compliance Code	unknow
Maximum access time	3.5 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
memory density	8388608 bi
Memory IC Type	STANDARD SRAM
memory width	32
Number of terminals	119
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	3.3 V
Certification status	Not Qualified
Maximum standby current	0.02 A
Minimum standby current	3.14 V
Maximum slew rate	0.85 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM

	EDI2DL32256V35BC	EDI2DL32256V	EDI2DL32256V38BC
Description	256Kx32 Synchronous Pipline Burst SRAM 3.3V	256Kx32 Synchronous Pipline Burst SRAM 3.3V	256Kx32 Synchronous Pipline Burst SRAM 3.3V
Is it Rohs certified?	incompatible	-	incompatible
Maker	White Electronic Designs Corporation	-	White Electronic Designs Corporation
package instruction	BGA, BGA119,7X17,50	-	BGA, BGA119,7X17,50
Reach Compliance Code	unknow	-	unknow
Maximum access time	3.5 ns	-	3.8 ns
I/O type	COMMON	-	COMMON
JESD-30 code	R-PBGA-B119	-	R-PBGA-B119
JESD-609 code	e0	-	e0
memory density	8388608 bi	-	8388608 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM
memory width	32	-	32
Number of terminals	119	-	119
word count	262144 words	-	262144 words
character code	256000	-	256000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C
organize	256KX32	-	256KX32
Output characteristics	3-STATE	-	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	BGA	-	BGA
Encapsulate equivalent code	BGA119,7X17,50	-	BGA119,7X17,50
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	GRID ARRAY	-	GRID ARRAY
Parallel/Serial	PARALLEL	-	PARALLEL
power supply	3.3 V	-	3.3 V
Certification status	Not Qualified	-	Not Qualified
Maximum standby current	0.02 A	-	0.02 A
Minimum standby current	3.14 V	-	3.14 V
Maximum slew rate	0.85 mA	-	0.85 mA
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V
surface mount	YES	-	YES
technology	CMOS	-	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	BALL	-	BALL
Terminal pitch	1.27 mm	-	1.27 mm
Terminal location	BOTTOM	-	BOTTOM

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