1PMT5920B Series
3.2 Watt Plastic
Surface Mount
POWERMITE
®
Package
This complete new line of 3.2 Watt Zener Diodes are offered in
highly efficient micro miniature, space saving surface mount with its
unique heat sink design. The POWERMITE package has the same
thermal performance as the SMA while being 50% smaller in
footprint area and delivering one of the lowest height profiles (1.1
mm) in the industry. Because of its small size, it is ideal for use in
cellular phones, portable devices, business machines and many other
industrial/consumer applications.
Specification Features:
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PLASTIC SURFACE MOUNT
3.2 WATT ZENER DIODES
6.2 − 47 VOLTS
•
•
•
•
•
•
•
•
•
Zener Breakdown Voltage: 6.2 − 47 Volts
DC Power Dissipation: 3.2 Watts with Tab 1 (Cathode) @ 75°C
Low Leakage < 5
mA
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Low Profile − Maximum Height of 1.1 mm
Integral Heat Sink/Locking Tabs
Full Metallic Bottom Eliminates Flux Entrapment
Small Footprint − Footprint Area of 8.45 mm
2
Supplied in 12 mm Tape and Reel
T1 = 3,000 Units per Reel
T3 = 12,000 Units per Reel
•
POWERMITE is JEDEC Registered as DO−216AA
•
Cathode Indicated by Polarity Band
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
FINISH:
All external surfaces are corrosion resistant and leads are
1
1: CATHODE
2: ANODE
2
1
2
POWERMITE
CASE 457
PLASTIC
MARKING DIAGRAM
D
2
ANODE
readily solderable
MOUNTING POSITION:
Any
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1
CATHODE
xxB
xx
D
xxB
260°C for 10 Seconds
= Specific Device Code
= 20 − 41
=
(See Table Next Page)
= Date Code
ORDERING INFORMATION
Device
Package
Shipping
1PMT59xxBT1 POWERMITE 3,000/Tape & Reel
1PMT59xxBT3 POWERMITE 12,000/Tape & Reel
LEAD ORIENTATION IN TAPE:
Cathode (Short) Lead to Sprocket Holes
©
Semiconductor Components Industries, LLC, 2003
1
July, 2003 − Rev. 0
Publication Order Number:
1PMT5920B/D
1PMT5920B Series
MAXIMUM RATINGS
Rating
DC Power Dissipation @ T
A
= 25°C (Note 1)
Derate above 25°C
Thermal Resistance from Junction to Ambient
Thermal Resistance from Junction to Lead (Anode)
Maximum DC Power Dissipation (Note 2)
Thermal Resistance from Junction to Tab (Cathode)
Operating and Storage Temperature Range
1. Mounted with recommended minimum pad size, PC board FR−4.
2. At Tab (Cathode) temperature, T
tab
= 75°C
Symbol
°P
D
°
R
qJA
R
qJanode
°P
D
°
R
qJcathode
T
J
, T
stg
Value
500
4.0
248
35
3.2
23
−55 to +150
Unit
°mW
mW/°C
°C/W
°C/W
W
°C/W
°C
ELECTRICAL CHARACTERISTICS
(T
L
= 25°C unless
otherwise noted, V
F
= 1.5 V Max. @ I
F
= 200 mAdc for all types)
Symbol
V
Z
I
ZT
Z
ZT
I
ZK
Z
ZK
I
R
V
R
I
F
V
F
Parameter
Reverse Zener Voltage @ I
ZT
Reverse Current
Maximum Zener Impedance @ I
ZT
Reverse Current
Maximum Zener Impedance @ I
ZK
Reverse Leakage Current @ V
R
Reverse Voltage
Forward Current
Forward Voltage @ I
F
V
Z
V
R
I
F
I
I
R
V
F
I
ZT
V
Zener Voltage Regulator
ELECTRICAL CHARACTERISTICS
(T
L
= 30°C unless otherwise noted, V
F
= 1.25 Volts @ 200 mA)
Zener Voltage
(Note 3)
Device
Marking
20B
21B
22B
23B
24B
25B
27B
29B
30B
31B
33B
34B
35B
36B
39B
41B
V
Z
@ I
ZT
(Volts)
Min
5.89
6.46
7.12
7.79
8.64
9.5
11.4
14.25
15.2
17.1
20.9
22.8
25.65
28.5
37.05
44.65
Nom
6.2
6.8
7.5
8.2
9.1
10
12
15
16
18
22
24
27
30
39
47
Max
6.51
7.14
7.88
8.61
9.56
10.5
12.6
15.75
16.8
18.9
23.1
25.2
28.35
31.5
40.95
49.35
I
ZT
(mA)
60.5
55.1
50
45.7
41.2
37.5
31.2
25
23.4
20.8
17
15.6
13.9
12.5
9.6
8.0
I
R
@ V
R
(mA)
5.0
5.0
5.0
5.0
5.0
5.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
V
R
(V)
4.0
5.2
6.0
6.5
7.0
8.0
9.1
11.4
12.2
13.7
16.7
18.2
20.6
22.8
29.7
35.8
Z
ZT
@ I
ZT
(Note 4)
(W)
2.0
2.5
3.0
3.5
4.0
4.5
6.5
9.0
10
12
17.5
19
23
28
45
67
Z
ZK
@ I
ZK
(Note 4)
(W)
200
200
400
400
500
500
550
600
600
650
650
700
700
750
900
1000
I
ZK
(mA)
1.0
1.0
0.5
0.5
0.5
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Device
1PMT5920BT1, T3
1PMT5921BT1, T3
1PMT5922BT1, T3
1PMT5923BT1, T3
1PMT5924BT1, T3
1PMT5925BT1, T3
1PMT5927BT1, T3
1PMT5929BT1, T3
1PMT5930BT1, T3
1PMT5931BT1, T3
1PMT5933BT1, T3
1PMT5934BT1, T3
1PMT5935BT1, T3
1PMT5936BT1, T3
1PMT5939BT1, T3
1PMT5941BT1, T3
3. Zener voltage is measured with the device junction in thermal equilibrium with an ambient temperature of 25°C.
4. Zener Impedance Derivation Z
ZT
and Z
ZK
are measured by dividing the AC voltage drop across the device by the AC current applied. The
specified limits are for I
Z
(ac) = 0.1 I
Z
(dc) with the ac frequency = 60 Hz.
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2
1PMT5920B Series
TYPICAL CHARACTERISTICS
P D , MAXIMUM POWER DISSIPATION (W)
3.5
3
2.5
2
1.5
1
0.5
0
25
50
75
100
125
150
175
T, TEMPERATURE (°C)
0.1
5
6
7
8
9
10
V
Z
, ZENER VOLTAGE (VOLTS)
11
T
L
100
I
Z
, ZENER CURRENT (mA)
10
1
Figure 1. Steady State Power Derating
q
VZ
, TEMPERATURE COEFFICIENT (mV/°C)
100
IZ , ZENER CURRENT (mA)
50
30
20
10
5
3
2
1
0.5
0.3
0.2
0.1
0
10
20
30
40
50
60
70
80
V
Z
, ZENER VOLTAGE (VOLTS)
90
100
10
8
6
4
2
0
−2
−4
2
4
V
Z
@ I
ZT
Figure 2. V
Z
to 10 Volts
6
8
10
V
Z
, ZENER VOLTAGE (VOLTS)
12
Figure 3. V
Z
= 12 thru 47 Volts
q
VZ
, TEMPERATURE COEFFICIENT (mV/°C)
200
ZZ , DYNAMIC IMPEDANCE (OHMS)
V
Z
@ I
ZT
100
70
50
30
20
Figure 4. Zener Voltage − To 12 Volts
200
I
Z(dc)
= 1mA
100
70
50
30
20
10
7
5
3
2
5
7
10 mA
20 mA
i
Z(rms)
= 0.1 I
Z(dc)
70
100
10
10
20
30
50
70
100
V
Z
, ZENER VOLTAGE (VOLTS)
200
10
20
30
50
V
Z
, ZENER VOLTAGE (VOLTS)
Figure 5. Zener Voltage − 14 To 47 Volts
Figure 6. Effect of Zener Voltage
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3
1PMT5920B Series
Z Z , DYNAMIC IMPEDANCE (OHMS)
1k
500
200
100
50
20
10
5
2
1
0.5 1
22 V
6.8 V
2
5
10
20
50 100 200
500
I
Z
, ZENER TEST CURRENT (mA)
12 V
T
J
= 25°C
i
Z(rms)
= 0.1 I
Z(dc)
Figure 7. Effect of Zener Current
10,000
C, CAPACITANCE (pF)
1000
MEASURED @ 0 V BIAS
MEASURED @ 50% V
R
100
10
1
10
V
Z
, REVERSE ZENER VOLTAGE (VOLTS)
100
Figure 8. Capacitance versus Reverse
Zener Voltage
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4
1PMT5920B Series
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 9 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems, but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2 STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177−189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 6
VENT
STEP 7
COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
STEP 4
STEP 5
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
SOAK"
SPIKE"
170°C
160°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
150°C
100°C
100°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 9. Typical Solder Heating Profile
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