|
AT29C512-70JC |
AT29C512-90JC |
N959-07-229R-BD |
AT29C512-90TC |
Description |
NOR Flash 512K(64Kx8) 5V ONLY 70NS COM TEMP |
Flash Memory 512K(64Kx8) 5V ONLY 90NS COM TEMP |
Array/Network Resistor, Isolated, Thin Film, 0.1W, 229ohm, 50V, 0.1% +/-Tol, -25,25ppm/Cel, 2021, |
NOR Flash 512K(64Kx8) 5V ONLY 90NS COM TEMP |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
Reach Compliance Code |
unknown |
unknown |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Number of terminals |
32 |
32 |
8 |
32 |
Maximum operating temperature |
70 °C |
70 °C |
150 °C |
70 °C |
Package form |
CHIP CARRIER |
CHIP CARRIER |
SMT |
SMALL OUTLINE, THIN PROFILE |
technology |
CMOS |
CMOS |
THIN FILM |
CMOS |
Maker |
Atmel (Microchip) |
Atmel (Microchip) |
- |
Atmel (Microchip) |
Parts packaging code |
QFJ |
QFJ |
- |
TSOP1 |
package instruction |
PLASTIC, MS-016AE, LCC-32 |
PLASTIC, MS-016AE, LCC-32 |
- |
8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 |
Contacts |
32 |
32 |
- |
32 |
Maximum access time |
70 ns |
90 ns |
- |
90 ns |
Other features |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
- |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
command user interface |
NO |
NO |
- |
NO |
Data polling |
YES |
YES |
- |
YES |
Durability |
10000 Write/Erase Cycles |
10000 Write/Erase Cycles |
- |
10000 Write/Erase Cycles |
JESD-30 code |
R-PQCC-J32 |
R-PQCC-J32 |
- |
R-PDSO-G32 |
JESD-609 code |
e0 |
e0 |
- |
e0 |
length |
13.97 mm |
13.97 mm |
- |
18.4 mm |
memory density |
524288 bit |
524288 bit |
- |
524288 bit |
Memory IC Type |
FLASH |
FLASH |
- |
FLASH |
memory width |
8 |
8 |
- |
8 |
Humidity sensitivity level |
2 |
2 |
- |
3 |
Number of functions |
1 |
1 |
- |
1 |
Number of departments/size |
512 |
512 |
- |
512 |
word count |
65536 words |
65536 words |
- |
65536 words |
character code |
64000 |
64000 |
- |
64000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
- |
ASYNCHRONOUS |
organize |
64KX8 |
64KX8 |
- |
64KX8 |
Output characteristics |
3-STATE |
3-STATE |
- |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
QCCJ |
- |
TSOP1 |
Encapsulate equivalent code |
LDCC32,.5X.6 |
LDCC32,.5X.6 |
- |
TSSOP32,.8,20 |
Package shape |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
page size |
128 words |
128 words |
- |
128 words |
Parallel/Serial |
PARALLEL |
PARALLEL |
- |
PARALLEL |
Peak Reflow Temperature (Celsius) |
225 |
225 |
- |
240 |
power supply |
5 V |
5 V |
- |
5 V |
Programming voltage |
5 V |
5 V |
- |
5 V |
Certification status |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Maximum seat height |
3.556 mm |
3.556 mm |
- |
1.2 mm |
Department size |
128 |
128 |
- |
128 |
Maximum standby current |
0.0001 A |
0.0001 A |
- |
0.0001 A |
Maximum slew rate |
0.05 mA |
0.05 mA |
- |
0.05 mA |
Maximum supply voltage (Vsup) |
5.25 V |
5.5 V |
- |
5.5 V |
Minimum supply voltage (Vsup) |
4.75 V |
4.5 V |
- |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
- |
5 V |
surface mount |
YES |
YES |
- |
YES |
Temperature level |
COMMERCIAL |
COMMERCIAL |
- |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Terminal form |
J BEND |
J BEND |
- |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
- |
0.5 mm |
Terminal location |
QUAD |
QUAD |
- |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
- |
30 |
switch bit |
YES |
YES |
- |
YES |
type |
NOR TYPE |
NOR TYPE |
- |
NOR TYPE |
width |
11.43 mm |
11.43 mm |
- |
8 mm |
Maximum write cycle time (tWC) |
10 ms |
10 ms |
- |
10 ms |