|
AT29BV010A-12JC |
AT29BV010A-15JI |
AT29BV010A-15JU |
AT29BV010A-15TI |
AT29BV010A-15JC |
AT29BV010A-12JU |
AT29BV010A-15TC |
AT29BV010A-15TU |
Description |
NOR Flash 1M (128K X 8) 2.7V- 120NS COM TEMP |
Flash Memory 1M(128Kx8) 2.7V 150NS IND TEMP |
Flash Memory 1M(128Kx8) 2.7V - 150NS IND TEMP |
Flash Memory 1M(128Kx8) 2.7V 150NS IND TEMP |
Flash Memory 1M(128Kx8) 2.7V- 150NS COM TEMP |
Flash Memory 1M(128Kx8) 2.7V - 120NS IND TEMP |
NOR Flash 1M(128Kx8) 2.7V- 150NS COM TEMP |
NOR Flash 1M(128Kx8) 2.7V - 150NS IND TEMP |
Is it Rohs certified? |
incompatible |
incompatible |
conform to |
incompatible |
incompatible |
conform to |
incompatible |
conform to |
Maker |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Parts packaging code |
QFJ |
QFJ |
QFJ |
TSOP1 |
QFJ |
QFJ |
TSOP1 |
TSOP1 |
package instruction |
PLASTIC, MS-016AE, LCC-32 |
PLASTIC, MS-016AE, LCC-32 |
LEAD AND HALIDE FREE, PLASTIC, MS-016AE, LCC-32 |
8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 |
PLASTIC, MS-016AE, LCC-32 |
LEAD AND HALIDE FREE, PLASTIC, MS-016AE, LCC-32 |
8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 |
8 X 20 MM, LEAD AND HALIDE FREE, PLASTIC, MO-142BD, TSOP1-32 |
Contacts |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
Reach Compliance Code |
compliant |
compliant |
unknown |
compliant |
compliant |
unknown |
compliant |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum access time |
120 ns |
150 ns |
150 ns |
150 ns |
150 ns |
120 ns |
150 ns |
150 ns |
startup block |
BOTTOM/TOP |
BOTTOM/TOP |
BOTTOM/TOP |
BOTTOM/TOP |
BOTTOM/TOP |
BOTTOM/TOP |
BOTTOM/TOP |
BOTTOM/TOP |
command user interface |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
Data polling |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
JESD-30 code |
R-PQCC-J32 |
R-PQCC-J32 |
R-PQCC-J32 |
R-PDSO-G32 |
R-PQCC-J32 |
R-PQCC-J32 |
R-PDSO-G32 |
R-PDSO-G32 |
JESD-609 code |
e0 |
e0 |
e3 |
e0 |
e0 |
e3 |
e0 |
e3 |
length |
13.97 mm |
13.97 mm |
13.97 mm |
18.4 mm |
13.97 mm |
13.97 mm |
18.4 mm |
18.4 mm |
memory density |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
Memory IC Type |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Humidity sensitivity level |
2 |
2 |
2 |
3 |
2 |
2 |
3 |
3 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of departments/size |
1,1,1 |
1,1,1 |
1,1,1 |
1,1,1 |
1,1,1 |
1,1,1 |
1,1,1 |
1,1,1 |
Number of terminals |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
word count |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
character code |
128000 |
128000 |
128000 |
128000 |
128000 |
128000 |
128000 |
128000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
85 °C |
85 °C |
85 °C |
70 °C |
85 °C |
70 °C |
85 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
- |
-40 °C |
organize |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
QCCJ |
QCCJ |
TSOP1 |
QCCJ |
QCCJ |
TSOP1 |
TSOP1 |
Encapsulate equivalent code |
LDCC32,.5X.6 |
LDCC32,.5X.6 |
LDCC32,.5X.6 |
TSSOP32,.8,20 |
LDCC32,.5X.6 |
LDCC32,.5X.6 |
TSSOP32,.8,20 |
TSSOP32,.8,20 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
SMALL OUTLINE, THIN PROFILE |
CHIP CARRIER |
CHIP CARRIER |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
225 |
225 |
245 |
240 |
225 |
245 |
240 |
260 |
power supply |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
Programming voltage |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
3.556 mm |
3.556 mm |
3.556 mm |
1.2 mm |
3.556 mm |
3.556 mm |
1.2 mm |
1.2 mm |
Department size |
8K,112K,8K |
8K,112K,8K |
8K,112K,8K |
8K,112K,8K |
8K,112K,8K |
8K,112K,8K |
8K,112K,8K |
8K,112K,8K |
Maximum standby current |
0.00004 A |
0.00005 A |
0.00005 A |
0.00005 A |
0.00004 A |
0.00005 A |
0.00004 A |
0.00005 A |
Maximum slew rate |
0.015 mA |
0.015 mA |
0.015 mA |
0.015 mA |
0.015 mA |
0.015 mA |
0.015 mA |
0.015 mA |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
Terminal form |
J BEND |
J BEND |
J BEND |
GULL WING |
J BEND |
J BEND |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
0.5 mm |
1.27 mm |
1.27 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
DUAL |
QUAD |
QUAD |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
40 |
30 |
30 |
40 |
30 |
30 |
switch bit |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
type |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
width |
11.43 mm |
11.43 mm |
11.43 mm |
8 mm |
11.43 mm |
11.43 mm |
8 mm |
8 mm |
Maximum write cycle time (tWC) |
20 ms |
20 ms |
20 ms |
20 ms |
20 ms |
20 ms |
20 ms |
20 ms |
Is it lead-free? |
Contains lead |
Contains lead |
Lead free |
- |
Contains lead |
Lead free |
- |
- |
Base Number Matches |
1 |
1 |
- |
1 |
1 |
1 |
1 |
1 |