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AT29BV010A-12JC

Description
NOR Flash 1M (128K X 8) 2.7V- 120NS COM TEMP
Categorystorage    storage   
File Size211KB,16 Pages
ManufacturerAtmel (Microchip)
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AT29BV010A-12JC Overview

NOR Flash 1M (128K X 8) 2.7V- 120NS COM TEMP

AT29BV010A-12JC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeQFJ
package instructionPLASTIC, MS-016AE, LCC-32
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time120 ns
startup blockBOTTOM/TOP
command user interfaceNO
Data pollingYES
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.97 mm
memory density1048576 bit
Memory IC TypeFLASH
memory width8
Humidity sensitivity level2
Number of functions1
Number of departments/size1,1,1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply3/3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height3.556 mm
Department size8K,112K,8K
Maximum standby current0.00004 A
Maximum slew rate0.015 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
switch bitYES
typeNOR TYPE
width11.43 mm
Maximum write cycle time (tWC)20 ms
Base Number Matches1

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Description NOR Flash 1M (128K X 8) 2.7V- 120NS COM TEMP Flash Memory 1M(128Kx8) 2.7V 150NS IND TEMP Flash Memory 1M(128Kx8) 2.7V - 150NS IND TEMP Flash Memory 1M(128Kx8) 2.7V 150NS IND TEMP Flash Memory 1M(128Kx8) 2.7V- 150NS COM TEMP Flash Memory 1M(128Kx8) 2.7V - 120NS IND TEMP NOR Flash 1M(128Kx8) 2.7V- 150NS COM TEMP NOR Flash 1M(128Kx8) 2.7V - 150NS IND TEMP
Is it Rohs certified? incompatible incompatible conform to incompatible incompatible conform to incompatible conform to
Maker Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code QFJ QFJ QFJ TSOP1 QFJ QFJ TSOP1 TSOP1
package instruction PLASTIC, MS-016AE, LCC-32 PLASTIC, MS-016AE, LCC-32 LEAD AND HALIDE FREE, PLASTIC, MS-016AE, LCC-32 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 PLASTIC, MS-016AE, LCC-32 LEAD AND HALIDE FREE, PLASTIC, MS-016AE, LCC-32 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 8 X 20 MM, LEAD AND HALIDE FREE, PLASTIC, MO-142BD, TSOP1-32
Contacts 32 32 32 32 32 32 32 32
Reach Compliance Code compliant compliant unknown compliant compliant unknown compliant unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 150 ns 150 ns 150 ns 150 ns 120 ns 150 ns 150 ns
startup block BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP
command user interface NO NO NO NO NO NO NO NO
Data polling YES YES YES YES YES YES YES YES
JESD-30 code R-PQCC-J32 R-PQCC-J32 R-PQCC-J32 R-PDSO-G32 R-PQCC-J32 R-PQCC-J32 R-PDSO-G32 R-PDSO-G32
JESD-609 code e0 e0 e3 e0 e0 e3 e0 e3
length 13.97 mm 13.97 mm 13.97 mm 18.4 mm 13.97 mm 13.97 mm 18.4 mm 18.4 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8 8
Humidity sensitivity level 2 2 2 3 2 2 3 3
Number of functions 1 1 1 1 1 1 1 1
Number of departments/size 1,1,1 1,1,1 1,1,1 1,1,1 1,1,1 1,1,1 1,1,1 1,1,1
Number of terminals 32 32 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C 70 °C 85 °C 70 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C - -40 °C - -40 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ QCCJ TSOP1 QCCJ QCCJ TSOP1 TSOP1
Encapsulate equivalent code LDCC32,.5X.6 LDCC32,.5X.6 LDCC32,.5X.6 TSSOP32,.8,20 LDCC32,.5X.6 LDCC32,.5X.6 TSSOP32,.8,20 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER SMALL OUTLINE, THIN PROFILE CHIP CARRIER CHIP CARRIER SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 245 240 225 245 240 260
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.556 mm 3.556 mm 3.556 mm 1.2 mm 3.556 mm 3.556 mm 1.2 mm 1.2 mm
Department size 8K,112K,8K 8K,112K,8K 8K,112K,8K 8K,112K,8K 8K,112K,8K 8K,112K,8K 8K,112K,8K 8K,112K,8K
Maximum standby current 0.00004 A 0.00005 A 0.00005 A 0.00005 A 0.00004 A 0.00005 A 0.00004 A 0.00005 A
Maximum slew rate 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal form J BEND J BEND J BEND GULL WING J BEND J BEND GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 0.5 mm 1.27 mm 1.27 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD DUAL QUAD QUAD DUAL DUAL
Maximum time at peak reflow temperature 30 30 40 30 30 40 30 30
switch bit YES YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 11.43 mm 11.43 mm 11.43 mm 8 mm 11.43 mm 11.43 mm 8 mm 8 mm
Maximum write cycle time (tWC) 20 ms 20 ms 20 ms 20 ms 20 ms 20 ms 20 ms 20 ms
Is it lead-free? Contains lead Contains lead Lead free - Contains lead Lead free - -
Base Number Matches 1 1 - 1 1 1 1 1
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