AX8052F143-2-TB05 datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> AX8052F143-2-TB05

AX8052F143-2-TB05: DescriptionRF System on a Chip - SoC RF-MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size461KB，45 Pages; ManufacturerON Semiconductor; Websitehttp://www.onsemi.cn

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AX8052F143-2-TB05 Overview

RF System on a Chip - SoC RF-MICROCONTROLLER

AX8052F143-2-TB05 Parametric

Parameter Name	Attribute value
Brand Name	ON Semiconductor
Is it lead-free?	Lead free
Maker	ON Semiconductor
package instruction	HVQCCN, LCC40,.2X.28,20
Manufacturer packaging code	485EG
Reach Compliance Code	compliant
Samacsys Description	AX8052F143-2-TB05, RF Transceiver 27 → 1050MHz, AFSK, ASK, FM, FSK, GFSK, GMSK, MSK, PSK, QFSK,
Has ADC	YES
Address bus width
bit size	8
boundary scan	NO
CPU series	8052
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-PQCC-N40
length	7 mm
low power mode	YES
Humidity sensitivity level	1
Number of DMA channels	2
Number of terminals	40
Number of timers	3
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC40,.2X.28,20
Package shape	RECTANGULAR
Package form	CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG
RAM (bytes)	8192
RAM (number of words)	8192
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	1 mm
Maximum slew rate	200 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Gold/Palladium (Ni/Au/Pd)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
width	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

AX8052F143-2-TB05 Related Products

	AX8052F143-2-TB05	AX8052F143-2-TX30	F143-MINI-B-MOD-GEVB	F143-MINI-2-GEVK	AX8052F143-3-TB05	F143-MINI-A-MOD-GEVB	AX8052F143-3-TX30
Description	RF System on a Chip - SoC RF-MICROCONTROLLER	RF System on a Chip - SoC RF-MICROCONTROLLER	AX8052F143 MINI DVK MOD	AX8052F143 MINI DVK	RF-MICROCONTROLLER SOC	AX8052F143 MINI DVK MOD
Brand Name	ON Semiconductor	ON Semiconductor	-	-	ON Semiconductor	-	ON Semiconductor
Is it lead-free?	Lead free	Lead free	-	-	Lead free	-	Lead free
Maker	ON Semiconductor	ON Semiconductor	-	-	ON Semiconductor	-	ON Semiconductor
package instruction	HVQCCN, LCC40,.2X.28,20	HVQCCN, LCC40,.2X.28,20	-	-	QFN-40	-	HVQCCN, LCC40,.2X.28,20
Manufacturer packaging code	485EG	485EG	-	-	485EG	-	485EG
Reach Compliance Code	compliant	compliant	-	-	compliant	-	compliant
Has ADC	YES	YES	-	-	YES	-	YES
bit size	8	8	-	-	8	-	8
boundary scan	NO	NO	-	-	NO	-	NO
CPU series	8052	8052	-	-	8052	-	8052
maximum clock frequency	20 MHz	50 MHz	-	-	20 MHz	-	50 MHz
DAC channel	NO	NO	-	-	NO	-	NO
DMA channel	YES	YES	-	-	YES	-	YES
Format	FIXED POINT	FIXED POINT	-	-	FIXED POINT	-	FIXED POINT
Integrated cache	NO	NO	-	-	NO	-	NO
JESD-30 code	R-PQCC-N40	R-PQCC-N40	-	-	R-PQCC-N40	-	R-PQCC-N40
length	7 mm	7 mm	-	-	7 mm	-	7 mm
low power mode	YES	YES	-	-	YES	-	YES
Humidity sensitivity level	1	1	-	-	1	-	1
Number of DMA channels	2	2	-	-	2	-	2
Number of terminals	40	40	-	-	40	-	40
Number of timers	3	3	-	-	3	-	3
On-chip data RAM width	8	8	-	-	8	-	8
On-chip program ROM width	8	8	-	-	8	-	8
Maximum operating temperature	85 °C	85 °C	-	-	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-	-40 °C	-	-40 °C
PWM channel	YES	YES	-	-	YES	-	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	HVQCCN	HVQCCN	-	-	HVQCCN	-	HVQCCN
Encapsulate equivalent code	LCC40,.2X.28,20	LCC40,.2X.28,20	-	-	LCC40,.2X.28,20	-	LCC40,.2X.28,20
Package shape	RECTANGULAR	SQUARE	-	-	RECTANGULAR	-	SQUARE
Package form	CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	-	CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM (bytes)	8192	8192	-	-	8192	-	8192
RAM (number of words)	8192	8192	-	-	8192	-	8192
rom(word)	65536	65536	-	-	65536	-	65536
ROM programmability	FLASH	FLASH	-	-	FLASH	-	FLASH
Maximum seat height	1 mm	1 mm	-	-	1 mm	-	1 mm
Maximum slew rate	200 mA	200 mA	-	-	200 mA	-	200 mA
Maximum supply voltage	3.6 V	3.6 V	-	-	3.6 V	-	3.6 V
Minimum supply voltage	1.8 V	1.8 V	-	-	1.8 V	-	1.8 V
Nominal supply voltage	3 V	3 V	-	-	3 V	-	3 V
surface mount	YES	YES	-	-	YES	-	YES
technology	CMOS	CMOS	-	-	CMOS	-	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	-	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	Nickel/Gold/Palladium (Ni/Au/Pd)	Nickel/Gold/Palladium (Ni/Au/Pd)	-	-	Nickel/Gold/Palladium (Ni/Au/Pd)	-	Nickel/Gold/Palladium (Ni/Au/Pd)
Terminal form	NO LEAD	NO LEAD	-	-	NO LEAD	-	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	-	-	0.5 mm	-	0.5 mm
Terminal location	QUAD	QUAD	-	-	QUAD	-	QUAD
width	5 mm	5 mm	-	-	5 mm	-	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	-	-	MICROCONTROLLER	-	MICROCONTROLLER

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