RF System on a Chip - SoC RF-MICROCONTROLLER
| Parameter Name | Attribute value |
| Brand Name | ON Semiconductor |
| Is it lead-free? | Lead free |
| Maker | ON Semiconductor |
| package instruction | HVQCCN, LCC40,.2X.28,20 |
| Manufacturer packaging code | 485EG |
| Reach Compliance Code | compliant |
| Has ADC | YES |
| Address bus width | |
| bit size | 8 |
| boundary scan | NO |
| CPU series | 8052 |
| maximum clock frequency | 50 MHz |
| DAC channel | NO |
| DMA channel | YES |
| External data bus width | |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-PQCC-N40 |
| length | 7 mm |
| low power mode | YES |
| Humidity sensitivity level | 1 |
| Number of DMA channels | 2 |
| Number of I/O lines | 19 |
| Number of terminals | 40 |
| Number of timers | 3 |
| On-chip data RAM width | 8 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC40,.2X.28,20 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| RAM (bytes) | 8192 |
| RAM (number of words) | 8192 |
| rom(word) | 65536 |
| ROM programmability | FLASH |
| Maximum seat height | 1 mm |
| speed | 150 MHz |
| Maximum slew rate | 200 mA |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 1.8 V |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Gold/Palladium (Ni/Au/Pd) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| width | 5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| AX8052F143-2-TX30 | AX8052F143-2-TB05 | F143-MINI-B-MOD-GEVB | F143-MINI-2-GEVK | AX8052F143-3-TB05 | F143-MINI-A-MOD-GEVB | AX8052F143-3-TX30 | |
|---|---|---|---|---|---|---|---|
| Description | RF System on a Chip - SoC RF-MICROCONTROLLER | RF System on a Chip - SoC RF-MICROCONTROLLER | AX8052F143 MINI DVK MOD | AX8052F143 MINI DVK | RF-MICROCONTROLLER SOC | AX8052F143 MINI DVK MOD | |
| Brand Name | ON Semiconductor | ON Semiconductor | - | - | ON Semiconductor | - | ON Semiconductor |
| Is it lead-free? | Lead free | Lead free | - | - | Lead free | - | Lead free |
| Maker | ON Semiconductor | ON Semiconductor | - | - | ON Semiconductor | - | ON Semiconductor |
| package instruction | HVQCCN, LCC40,.2X.28,20 | HVQCCN, LCC40,.2X.28,20 | - | - | QFN-40 | - | HVQCCN, LCC40,.2X.28,20 |
| Manufacturer packaging code | 485EG | 485EG | - | - | 485EG | - | 485EG |
| Reach Compliance Code | compliant | compliant | - | - | compliant | - | compliant |
| Has ADC | YES | YES | - | - | YES | - | YES |
| bit size | 8 | 8 | - | - | 8 | - | 8 |
| boundary scan | NO | NO | - | - | NO | - | NO |
| CPU series | 8052 | 8052 | - | - | 8052 | - | 8052 |
| maximum clock frequency | 50 MHz | 20 MHz | - | - | 20 MHz | - | 50 MHz |
| DAC channel | NO | NO | - | - | NO | - | NO |
| DMA channel | YES | YES | - | - | YES | - | YES |
| Format | FIXED POINT | FIXED POINT | - | - | FIXED POINT | - | FIXED POINT |
| Integrated cache | NO | NO | - | - | NO | - | NO |
| JESD-30 code | R-PQCC-N40 | R-PQCC-N40 | - | - | R-PQCC-N40 | - | R-PQCC-N40 |
| length | 7 mm | 7 mm | - | - | 7 mm | - | 7 mm |
| low power mode | YES | YES | - | - | YES | - | YES |
| Humidity sensitivity level | 1 | 1 | - | - | 1 | - | 1 |
| Number of DMA channels | 2 | 2 | - | - | 2 | - | 2 |
| Number of terminals | 40 | 40 | - | - | 40 | - | 40 |
| Number of timers | 3 | 3 | - | - | 3 | - | 3 |
| On-chip data RAM width | 8 | 8 | - | - | 8 | - | 8 |
| On-chip program ROM width | 8 | 8 | - | - | 8 | - | 8 |
| Maximum operating temperature | 85 °C | 85 °C | - | - | 85 °C | - | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | - | -40 °C | - | -40 °C |
| PWM channel | YES | YES | - | - | YES | - | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | HVQCCN | HVQCCN | - | - | HVQCCN | - | HVQCCN |
| Encapsulate equivalent code | LCC40,.2X.28,20 | LCC40,.2X.28,20 | - | - | LCC40,.2X.28,20 | - | LCC40,.2X.28,20 |
| Package shape | SQUARE | RECTANGULAR | - | - | RECTANGULAR | - | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG | - | - | CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| RAM (bytes) | 8192 | 8192 | - | - | 8192 | - | 8192 |
| RAM (number of words) | 8192 | 8192 | - | - | 8192 | - | 8192 |
| rom(word) | 65536 | 65536 | - | - | 65536 | - | 65536 |
| ROM programmability | FLASH | FLASH | - | - | FLASH | - | FLASH |
| Maximum seat height | 1 mm | 1 mm | - | - | 1 mm | - | 1 mm |
| Maximum slew rate | 200 mA | 200 mA | - | - | 200 mA | - | 200 mA |
| Maximum supply voltage | 3.6 V | 3.6 V | - | - | 3.6 V | - | 3.6 V |
| Minimum supply voltage | 1.8 V | 1.8 V | - | - | 1.8 V | - | 1.8 V |
| Nominal supply voltage | 3 V | 3 V | - | - | 3 V | - | 3 V |
| surface mount | YES | YES | - | - | YES | - | YES |
| technology | CMOS | CMOS | - | - | CMOS | - | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | - | INDUSTRIAL |
| Terminal surface | Nickel/Gold/Palladium (Ni/Au/Pd) | Nickel/Gold/Palladium (Ni/Au/Pd) | - | - | Nickel/Gold/Palladium (Ni/Au/Pd) | - | Nickel/Gold/Palladium (Ni/Au/Pd) |
| Terminal form | NO LEAD | NO LEAD | - | - | NO LEAD | - | NO LEAD |
| Terminal pitch | 0.5 mm | 0.5 mm | - | - | 0.5 mm | - | 0.5 mm |
| Terminal location | QUAD | QUAD | - | - | QUAD | - | QUAD |
| width | 5 mm | 5 mm | - | - | 5 mm | - | 5 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | - | - | MICROCONTROLLER | - | MICROCONTROLLER |
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