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BZT52C33-TP

Description
Zener Diodes 500mW 33V
Categorysemiconductor    Discrete semiconductor   
File Size281KB,4 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
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Zener Diodes 500mW 33V

BZT52C33-TP Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerMCC
Product CategoryZener Diodes
RoHSDetails
Vz - Zener Voltage33 V
Mounting StyleSMD/SMT
Package / CaseSOD-123-2
Pd - Power Dissipation500 mW (1/2 W)
Voltage Tolerance-
Voltage Temperature Coefficient27.4 mV/C
Zener Current100 nA
Zz - Zener Impedance80 Ohms
Minimum Operating Temperature- 65 C
Maximum Operating Temperature+ 150 C
ConfigurationSingle
Test Current2 mA
PackagingCut Tape
PackagingMouseReel
PackagingReel
Height1.2 mm
Length2.85 mm
ProductZener Diode
Width1.8 mm
Ir - Reverse Current100 nA
NumOfPackaging3
Factory Pack Quantity3000
Vf - Forward Voltage0.9 V
Unit Weight0.001058 oz
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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BZT52C2V4
THRU
BZT52C43
500 mW
Zener Diode
2.4 to
43
Volts
Features
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
Halogen
free available upon request by adding suffix "-HF"
SOD-123
A
B
Unit
Absolute Maximum Ratings
Symbol
Rating
Rating
C
E
P
D
Power dissipation
500
mW
T
J
Junction Temperature
-65 to +150
T
STG
Storage Temperature Range
-65 to +150
H
D
J
Absolute Maximum Ratings
Symbol
Rating
Rating
Unit
G
DIM
R
thJA
Thermal Resistance Junction to
Ambient*
250
/W
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25
mm
2
Electrical Characteristics
Symbol
Rating
Rating
Unit
A
B
C
D
E
G
H
J
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.140
.152
3.55
3.85
.100
.112
2.55
2.85
.055
.071
1.40
1.80
-----
.053
-----
1.35
.012
.031
0.30
.78
.006
-----
0.15
-----
-----
.01
-----
.25
-----
.006
-----
.15
NOTE
SUGGESTED SOLDER
PAD LAYOUT
V
F
Maximum Forward Voltage
(I
F
=10mAdc)
0.9
V
0.093"
0.048”
0.036”
Revision: B
www.mccsemi.com
1
of
4
2013/01/01

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