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WV3HG2128M64EEU534D4MG

Description
2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED
Categorystorage    storage   
File Size200KB,11 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Environmental Compliance
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WV3HG2128M64EEU534D4MG Overview

2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED

WV3HG2128M64EEU534D4MG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerWhite Electronic Designs Corporation
package instructionDIMM,
Reach Compliance Codeunknow
access modeDUAL BANK PAGE BURST
Maximum access time0.5 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XZMA-N200
JESD-609 codee4
memory density17179869184 bi
Memory IC TypeDDR DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals200
word count268435456 words
character code256000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature
organize256MX64
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal surfaceGold (Au)
Terminal formNO LEAD
Terminal locationZIG-ZAG
Maximum time at peak reflow temperatureNOT SPECIFIED

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Description 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED 2GB - 2x128Mx64 DDR2 SDRAM UNBUFFERED
Is it Rohs certified? conform to - conform to conform to conform to conform to conform to conform to conform to
Maker White Electronic Designs Corporation - White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation
package instruction DIMM, - DIMM, DIMM, DIMM, DIMM, DIMM, DIMM, DIMM,
Reach Compliance Code unknow - unknow unknow unknow unknown unknow unknown unknow
access mode DUAL BANK PAGE BURST - DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 0.5 ns - 0.45 ns - - 0.45 ns 0.5 ns 0.6 ns 0.6 ns
Other features AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-XZMA-N200 - R-XZMA-N200 R-XZMA-N200 R-XZMA-N200 R-XZMA-N200 R-XZMA-N200 R-XZMA-N200 R-XZMA-N200
JESD-609 code e4 - e4 e4 e4 e4 e4 e4 e4
memory density 17179869184 bi - 17179869184 bi 17179869184 bi 17179869184 bi 17179869184 bit 17179869184 bi 17179869184 bit 17179869184 bi
Memory IC Type DDR DRAM MODULE - DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
memory width 64 - 64 64 64 64 64 64 64
Number of functions 1 - 1 1 1 1 1 1 1
Number of ports 1 - 1 1 1 1 1 1 1
Number of terminals 200 - 200 200 200 200 200 200 200
word count 268435456 words - 268435456 words 268435456 words 268435456 words 268435456 words 268435456 words 268435456 words 268435456 words
character code 256000000 - 256000000 256000000 256000000 256000000 256000000 256000000 256000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
organize 256MX64 - 256MX64 256MX64 256MX64 256MX64 256MX64 256MX64 256MX64
Package body material UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM - DIMM DIMM DIMM DIMM DIMM DIMM DIMM
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES - YES YES YES YES YES YES YES
Maximum supply voltage (Vsup) 1.9 V - 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V - 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount NO - NO NO NO NO NO NO NO
technology CMOS - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER - OTHER OTHER OTHER OTHER OTHER OTHER OTHER
Terminal surface Gold (Au) - Gold (Au) Gold (Au) Gold (Au) Gold (Au) Gold (Au) Gold (Au) Gold (Au)
Terminal form NO LEAD - NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location ZIG-ZAG - ZIG-ZAG ZIG-ZAG ZIG-ZAG ZIG-ZAG ZIG-ZAG ZIG-ZAG ZIG-ZAG
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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