16Mx64 REGISTERED SYNCHRONOUS DRAM
WEDPN16M64VR-XB2X | WEDPN16M64VR-100B2M | WEDPN16M64VR-125B2M | WEDPN16M64VR-133B2M | WEDPN16M64VR-125B2I | WEDPN16M64VR-125B2C | WEDPN16M64VR-133B2C | WEDPN16M64VR-100B2I | WEDPN16M64VR-100B2C | |
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Description | 16Mx64 REGISTERED SYNCHRONOUS DRAM | 16Mx64 REGISTERED SYNCHRONOUS DRAM | 16Mx64 REGISTERED SYNCHRONOUS DRAM | 16Mx64 REGISTERED SYNCHRONOUS DRAM | 16Mx64 REGISTERED SYNCHRONOUS DRAM | 16Mx64 REGISTERED SYNCHRONOUS DRAM | 16Mx64 REGISTERED SYNCHRONOUS DRAM | 16Mx64 REGISTERED SYNCHRONOUS DRAM | 16Mx64 REGISTERED SYNCHRONOUS DRAM |
Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | - | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
package instruction | - | 25 X 21 MM, PLASTIC, BGA-219 | 25 X 21 MM, PLASTIC, BGA-219 | 25 X 21 MM, PLASTIC, BGA-219 | BGA, | BGA, | BGA, | BGA, | BGA, |
Reach Compliance Code | - | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
access mode | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Maximum access time | - | 6 ns | 5.8 ns | 5.4 ns | 5.8 ns | 5.8 ns | 5.4 ns | 6 ns | 6 ns |
Other features | - | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | - | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 |
memory density | - | 1073741824 bi | 1073741824 bi | 1073741824 bi | 1073741824 bi | 1073741824 bi | 1073741824 bi | 1073741824 bi | 1073741824 bi |
Memory IC Type | - | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | - | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | - | 219 | 219 | 219 | 219 | 219 | 219 | 219 | 219 |
word count | - | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
character code | - | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | - | 125 °C | 125 °C | 125 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C |
Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -40 °C | - | - | -40 °C | - |
organize | - | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | - | YES | YES | YES | YES | YES | YES | YES | YES |
technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | - | MILITARY | MILITARY | MILITARY | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal form | - | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
self refresh | - | - | - | - | YES | YES | YES | YES | YES |