WEDPN16M64VR-133B2M datasheet, PDF

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WEDPN16M64VR-133B2M: Description16Mx64 REGISTERED SYNCHRONOUS DRAM; Categorystorage storage; File Size448KB，15 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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WEDPN16M64VR-133B2M Overview

16Mx64 REGISTERED SYNCHRONOUS DRAM

WEDPN16M64VR-133B2M Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	White Electronic Designs Corporation
package instruction	25 X 21 MM, PLASTIC, BGA-219
Reach Compliance Code	unknow
access mode	FOUR BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO REFRESH
JESD-30 code	R-PBGA-B219
memory density	1073741824 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	219
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16MX64
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED

WEDPN16M64VR-133B2M Related Products

	WEDPN16M64VR-133B2M	WEDPN16M64VR-100B2M	WEDPN16M64VR-125B2M	WEDPN16M64VR-XB2X	WEDPN16M64VR-125B2I	WEDPN16M64VR-125B2C	WEDPN16M64VR-133B2C	WEDPN16M64VR-100B2I	WEDPN16M64VR-100B2C
Description	16Mx64 REGISTERED SYNCHRONOUS DRAM	16Mx64 REGISTERED SYNCHRONOUS DRAM	16Mx64 REGISTERED SYNCHRONOUS DRAM	16Mx64 REGISTERED SYNCHRONOUS DRAM	16Mx64 REGISTERED SYNCHRONOUS DRAM	16Mx64 REGISTERED SYNCHRONOUS DRAM	16Mx64 REGISTERED SYNCHRONOUS DRAM	16Mx64 REGISTERED SYNCHRONOUS DRAM	16Mx64 REGISTERED SYNCHRONOUS DRAM
Is it Rohs certified?	incompatible	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation
package instruction	25 X 21 MM, PLASTIC, BGA-219	25 X 21 MM, PLASTIC, BGA-219	25 X 21 MM, PLASTIC, BGA-219	-	BGA,	BGA,	BGA,	BGA,	BGA,
Reach Compliance Code	unknow	unknow	unknow	-	unknow	unknow	unknow	unknow	unknow
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	5.4 ns	6 ns	5.8 ns	-	5.8 ns	5.8 ns	5.4 ns	6 ns	6 ns
Other features	AUTO REFRESH	AUTO REFRESH	AUTO REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	-	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219
memory density	1073741824 bi	1073741824 bi	1073741824 bi	-	1073741824 bi	1073741824 bi	1073741824 bi	1073741824 bi	1073741824 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	-	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	64	64	64	-	64	64	64	64	64
Number of functions	1	1	1	-	1	1	1	1	1
Number of ports	1	1	1	-	1	1	1	1	1
Number of terminals	219	219	219	-	219	219	219	219	219
word count	16777216 words	16777216 words	16777216 words	-	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	-	16000000	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	-	85 °C	70 °C	70 °C	85 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-	-40 °C	-	-	-40 °C	-
organize	16MX64	16MX64	16MX64	-	16MX64	16MX64	16MX64	16MX64	16MX64
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	-	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	-	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	-	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	-	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	-	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
self refresh	-	-	-	-	YES	YES	YES	YES	YES

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