BONDING DIAGRAM
| Parameter Name | Attribute value |
| Maker | SAMSUNG |
| Parts packaging code | QFP |
| package instruction | QFP, |
| Contacts | 80 |
| Reach Compliance Code | unknow |
| Has ADC | NO |
| Address bus width | |
| bit size | 4 |
| maximum clock frequency | 6 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PQFP-G80 |
| length | 20 mm |
| Number of I/O lines | 40 |
| Number of terminals | 80 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| ROM programmability | OTPROM |
| Maximum seat height | 3 mm |
| speed | 1.0475 MHz |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| width | 14 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
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