CD54ACT08F/3A Related Products
|
CD54ACT08F/3A |
CD54ACT08FX |
CD74ACT08M96 |
CD54AC08F |
CD54AC08FX |
CD54AC08F/3A |
CD74AC08M |
CD74ACT08E |
CD74ACT08MX |
CD74AC08E |
Description |
AND Gate, CMOS, CDIP14 |
AND Gate, CMOS, CDIP14 |
AND Gate, CMOS, PDSO14, |
AND Gate, CMOS, CDIP14 |
AND Gate, CMOS, CDIP14 |
AND Gate, CMOS, CDIP14 |
AND Gate, CMOS, PDSO14, |
AND Gate, CMOS, PDIP14, |
AND Gate, CMOS, PDSO14 |
AND Gate, CMOS, PDIP14, |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
JESD-30 code |
R-XDIP-T14 |
R-XDIP-T14 |
R-PDSO-G14 |
R-XDIP-T14 |
R-XDIP-T14 |
R-XDIP-T14 |
R-PDSO-G14 |
R-PDIP-T14 |
R-PDSO-G14 |
R-PDIP-T14 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
0.012 A |
0.012 A |
0.012 A |
0.012 A |
0.024 A |
0.024 A |
0.012 A |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-40 °C |
-55 °C |
Package body material |
CERAMIC |
CERAMIC |
PLASTIC/EPOXY |
CERAMIC |
CERAMIC |
CERAMIC |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
DIP |
SOP |
DIP |
DIP |
DIP |
SOP |
DIP |
SOP |
DIP |
Encapsulate equivalent code |
DIP14,.3 |
DIP14,.3 |
SOP14,.25 |
DIP14,.3 |
DIP14,.3 |
DIP14,.3 |
SOP14,.25 |
DIP14,.3 |
SOP14,.25 |
DIP14,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
power supply |
5 V |
5 V |
5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
3.3/5 V |
5 V |
5 V |
3.3/5 V |
Prop。Delay @ Nom-Sup |
13.8 ns |
13.8 ns |
12.9 ns |
12.2 ns |
12.2 ns |
12.2 ns |
12.2 ns |
12.9 ns |
13.8 ns |
12.2 ns |
Schmitt trigger |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
surface mount |
NO |
NO |
YES |
NO |
NO |
NO |
YES |
NO |
YES |
NO |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
AUTOMOTIVE |
MILITARY |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
package instruction |
DIP, DIP14,.3 |
DIP, DIP14,.3 |
SOP, SOP14,.25 |
- |
- |
- |
SOP, SOP14,.25 |
DIP, DIP14,.3 |
SOP, SOP14,.25 |
DIP, DIP14,.3 |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
- |
- |
- |
Maker |
- |
- |
RCA |
RCA |
RCA |
RCA |
RCA |
RCA |
RCA |
RCA |