74HCT27DB datasheet, PDF - EEWORLD Datasheet

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74HCT27DB: DescriptionLogic Gates TRIPLE 3-INPUT NOR GATE; Categorylogic logic; File Size135KB，17 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HCT27DB Overview

Logic Gates TRIPLE 3-INPUT NOR GATE

74HCT27DB Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SSOP
package instruction	SOT-337-1, SSOP-14
Contacts	14
Reach Compliance Code	unknown
series	HCT
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	6.2 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	NOR GATE
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of functions	3
Number of entries	3
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP14,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Prop。Delay @ Nom-Sup	26 ns
propagation delay (tpd)	32 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	5.3 mm
Base Number Matches	1

74HCT27DB Related Products

	74HCT27DB	74HC27PW-T	74HCT27PW-T	74HC27DB	74HCT27D-T	74HC27DB-T	74HCT27PW
Description	Logic Gates TRIPLE 3-INPUT NOR GATE	Logic Gates TRIPLE 3-INPUT NOR GATE	Logic Gates TRIPLE 3-INPUT NOR GATE	Logic Gates TRIPLE 3-INPUT NOR GATE	Logic Gates TRIPLE 3-INPUT NOR GATE	Logic Gates TRIPLE 3-INPUT NOR GATE	Logic Gates TRIPLE 3-INPUT NOR GATE
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Parts packaging code	SSOP	TSSOP	TSSOP	SSOP	SOIC	SSOP	TSSOP
package instruction	SOT-337-1, SSOP-14	SOT-402-1, TSSOP-14	SOT-402-1, TSSOP-14	SOT-337-1, SSOP-14	SOT-108-1, SO-14	SOT-337-1, SSOP-14	SOT-402-1, TSSOP-14
Contacts	14	14	14	14	14	14	14
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
series	HCT	HC/UH	HCT	HC/UH	HCT	HC/UH	HCT
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14
JESD-609 code	e4	e4	e4	e4	e4	e4	e4
length	6.2 mm	5 mm	5 mm	6.2 mm	8.65 mm	6.2 mm	5 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE
Humidity sensitivity level	1	1	1	1	1	1	1
Number of functions	3	3	3	3	3	3	3
Number of entries	3	3	3	3	3	3	3
Number of terminals	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	TSSOP	TSSOP	SSOP	SOP	SSOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260
propagation delay (tpd)	32 ns	27 ns	32 ns	27 ns	32 ns	27 ns	32 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2 mm	1.1 mm	1.1 mm	2 mm	1.75 mm	2 mm	1.1 mm
Maximum supply voltage (Vsup)	5.5 V	6 V	5.5 V	6 V	5.5 V	6 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	2 V	4.5 V	2 V	4.5 V	2 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30
width	5.3 mm	4.4 mm	4.4 mm	5.3 mm	3.9 mm	5.3 mm	4.4 mm
Base Number Matches	1	1	1	1	1	1	1

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