|
IRFU230A |
IRFR230A |
Description |
Advanced Power MOSFET |
Advanced Power MOSFET |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Fairchild |
Fairchild |
package instruction |
IN-LINE, R-PSIP-T3 |
SMALL OUTLINE, R-PSSO-G2 |
Contacts |
3 |
3 |
Reach Compliance Code |
unknow |
unknown |
ECCN code |
EAR99 |
EAR99 |
Avalanche Energy Efficiency Rating (Eas) |
150 mJ |
150 mJ |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
200 V |
200 V |
Maximum drain current (Abs) (ID) |
7.5 A |
7.5 A |
Maximum drain current (ID) |
7.5 A |
7.5 A |
Maximum drain-source on-resistance |
0.4 Ω |
0.4 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JESD-30 code |
R-PSIP-T3 |
R-PSSO-G2 |
JESD-609 code |
e0 |
e0 |
Number of components |
1 |
1 |
Number of terminals |
3 |
2 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Maximum operating temperature |
150 °C |
150 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
Maximum power dissipation(Abs) |
50 W |
50 W |
Maximum pulsed drain current (IDM) |
30 A |
30 A |
Certification status |
Not Qualified |
Not Qualified |
surface mount |
NO |
YES |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
GULL WING |
Terminal location |
SINGLE |
SINGLE |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
transistor applications |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |